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Taiyo Holdings and imec Achieve 700nm RDL Formation for Advanced Packaging, Accelerating AI and HPC Chip Performance
ChemAnalyst Japan Overview Taiyo Holdings, in collaboration with imec, announced the successful formation of 700nm Redistribution Layers (RDL) for advanced packaging using their next-generation FPIM series materials. This breakthrough is... -
CTX Thermal Solutions Expands TIM Portfolio with Thermal Pads, Graphite Foils for 5G, EV, and Medical Applications
SJN (Semiconductor Journal Network) USA Overview CTX Thermal Solutions has expanded its Thermal Interface Material (TIM) portfolio to enhance heat dissipation efficiency in electronic components, addressing thermal management challenges ... -
Analog Devices to Acquire Alif Semiconductor for up to $1.55 Billion, Bolstering ‘Physical Intelligence’ Platform
PR Newswire USA Overview Analog Devices, Inc. (ADI) has announced a definitive agreement to acquire Alif Semiconductor for $1.35 billion in cash, with potential for an additional $200 million. This acquisition will integrate Alif's AI-na... -
NVIDIA Develops 45°C Liquid Cooling System for Next-Gen Rubin AI Infrastructure, Enhancing Data Center Energy Efficiency
Facebook (NVIDIA Official) USA Overview NVIDIA has developed an innovative liquid cooling system for its next-generation Rubin AI infrastructure, capable of using heated liquid up to 45°C (113°F). This direct liquid cooling (DLC) system ... -
Indium Corporation’s Jason Chou to Present “Material Solutions for AI Industry” at SEMICON Taiwan
Indium Corporation USA Overview Indium Corporation's Jason Chou will deliver a presentation titled "Material Solutions for AI Industry from Packaging to System Assembly" at SEMICON Taiwan, held from September 2-4, 2026. His talk will foc... -
Henkel Unveils Loctite ABLESTIK CDF900 Series Conductive Die Attach Film with >8 W/m-K Thermal Conductivity for AI and HPC Packages
SpecialChem Germany Overview Henkel Adhesive Technologies has introduced the new Loctite ABLESTIK CDF900 series conductive die attach film (cDAF), revolutionizing advanced packaging for AI accelerators and HPC processors. This innovative... -
MDPI Review Compares Advanced Semiconductor Packaging: Spotlighting Thermal Management and Reliability Challenges
MDPI Switzerland Overview A review paper published in MDPI critically compares advanced packaging architectures, including 2D, 2.5D, and 3D integration, detailing challenges in thermal management, warpage from thermomechanical mismatch, ... -
AI Technology Unveils Enhanced Thermal Dissipation Molding Underfill for HBM and 3D DRAM to Boost Package Reliability
AI Technology, Inc. USA Overview AI Technology, Inc. (AIT) has announced a new Molding Underfill (MUF) with significantly enhanced thermal dissipation, targeting advanced semiconductor packaging like HBM, 3D DRAM, and AI processors. This... -
Intel to Unveil AI Infrastructure Innovations at AI Infra Summit 2026, Detailing Edge-to-Cloud Scaling Strategy and CEO Keynote
Intel USA Overview Intel announced it will showcase its vision and progress for scaling AI across edge, enterprise, cloud, and physical AI environments at the AI Infra Summit 2026. Company experts will illustrate how Intel's technology, ... -
Intel Unveils Next-Gen Processors for Agentic AI at Hot Chips 2026: Featuring 256-Core Diamond Rapids CPU and Inference-Optimized Crescent Island GPU
TechRadar USA Overview Intel showcased its next-generation hardware architectures optimized for agentic AI workloads at Hot Chips 2026. The lineup includes the "Wildcat Lake Core Series 3 SoC" for client and edge devices, the "Crescent I...
