Samsung Electronics– tag –
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HBM4E Set to Dominate High-Performance Memory Market by Late 2026-2027 with Up to 4.0 TB/s Single-Stack Bandwidth and 48GB+ Capacity, Accelerating AI Models
Ersa Electronics Global Overview HBM4E is projected to lead the high-performance memory market from late 2026 to 2027, offering a single-stack bandwidth of up to 3.6–4.0 TB/s and capacities exceeding 48GB, significantly boosting ultra-la... -
Hanmi Semiconductor Secures ₩44.2 Billion SK hynix Order for HBM4 TC Bonders, Signaling Robust Advanced Packaging Equipment Market Growth
HTX South Korea Overview Hanmi Semiconductor has received a significant ₩44.2 billion (approx. $32 million) order from SK hynix for its TC Bonder 4.5 Griffin, crucial for next-generation HBM4 production, with delivery slated for early Se... -
Samsung and SK Hynix Announce Major HBM Capacity Expansions: Samsung Allocates Half to HBM4, Targeting 250K Wafers/Month by EOY 2026
Industry News / ChosunBiz South Korea Overview Samsung Electronics announced plans to increase its HBM production capacity by approximately 50% from 2025 levels, aiming for 250,000 semiconductor wafers per month by the end of 2026. The c... -
TSMC’s CoWoS Packaging Capacity Identified as Bottleneck in Korea’s HBM4E Race, Despite SK hynix and Samsung Shipments
Aju Press South Korea Overview Despite SK hynix and Samsung Electronics commencing sample shipments of 12-layer HBM4E chips to major customers like Nvidia, TSMC's CoWoS advanced packaging capacity is highlighted as the true bottleneck in... -
Samsung Validates Hybrid Copper Bonding’s Superior Thermal Management for HBM4E, Outperforming TCB
ET News (via IEEE paper) South Korea Overview Samsung published research in IEEE demonstrating that its Hybrid Copper Bonding (HCB) offers significant thermal management advantages over conventional Thermo-Compression Bonding (TCB) for H... -
Samsung Considers New HBM-Focused Advanced Semiconductor Packaging Plant in South Korea’s Honam Region to Meet AI Server Demand
SamMobile South Korea Overview Samsung Electronics is exploring the construction of a new advanced semiconductor packaging facility in South Korea's Honam region, with Gwangju emerging as a prime candidate. This project aims to bolster S... -
Intel Appoints Former SK hynix CEO Lee Seok-hee as Senior VP of Advanced Packaging to Bolster AI Systems
The Korea Herald South Korea Overview Intel has appointed Lee Seok-hee, former CEO of SK hynix and SK On, as Senior Vice President of Intel Foundry. Lee will lead advanced packaging, system integration, back-end technology development, a... -
Micron’s HBM Capacity Sold Out Through 2026, Securing Position in NVIDIA’s Next-Gen AI Platform “Vera Rubin”
Investing.com USA Overview Micron Technology has announced that its high-bandwidth memory (HBM) production capacity is completely sold out through 2026, with long-term contracts secured, reflecting overwhelming demand for AI-driven HBM. ... -
Samsung’s Advanced Packaging Lag Clouds AI Chip Comeback, Falling Behind TSMC and Intel
digitimes Taiwan Overview Despite efforts in HBM and foundry services, Samsung Electronics' lagging advanced packaging capabilities remain a significant weakness in the AI chip supply chain. Industry sources and Korean media reports indi... -
AI Infrastructure Demand Intensifies Memory Shortage: TSMC CoWoS Constraints and Vietnam Labor Shortages Create Compound Challenges
Sourceability USA Overview Rising AI infrastructure demand is generating new challenges across the semiconductor supply chain, notably a worsening memory shortage. TSMC's CoWoS packaging limitations are expected to persist with the AI bo...
