Samsung Electronics– tag –
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TSMC’s CoWoS Shortage Eases, But Bottleneck Shifts to ‘Hyper-Scale Packaging’ as Google Reportedly Engages Samsung for TPU Production
Zhitong Finance APP Hong Kong Overview Reports suggest Google is in discussions with Samsung Electronics regarding the production of specific hardware components for its AI training and inference Tensor Processing Units (TPUs), highlight... -
Glass Core Substrates Emerge as Next-Gen AI/HPC Packaging Technology, Face Commercialization Hurdles in Brittleness and TGV Formation
Pandaily China Overview Glass core substrates are garnering significant attention in the semiconductor packaging industry, driven by escalating performance demands in AI chips, HPC, and advanced processor packaging. They offer superior d... -
Henkel Expands Electronics Materials Investment in Korea, Bolstering HBM Packaging Material Development for Surging AI Semiconductor Demand
The Elec Inc. South Korea Overview German materials giant Henkel is expanding its investment in the electronics materials business in South Korea to meet the escalating demand for AI semiconductors. This includes reinforcing R&D pers... -
TSMC’s CoWoS Capacity, Targeting 125K-130K Wafers/Month by 2026, Still Falls Short as Nvidia Reserves 60% of Output
INDmoney India Overview TSMC's CoWoS advanced packaging remains a hidden bottleneck in AI chip supply, despite targeting 125,000-130,000 wafers per month capacity by the end of 2026. Demand continues to outstrip supply, with TSMC's CEO s... -
Samsung, SK Hynix Eye Honam Region in South Korea for First Advanced Packaging Fabs Amid Soaring AI Memory Demand; Amkor Plans $980M Expansion
The Elec Inc. South Korea Overview Samsung Electronics and SK Hynix are considering establishing their first advanced semiconductor packaging plants in South Korea's Honam region to meet surging AI infrastructure demand. Samsung is weigh... -
Samsung Unveils Industry’s Smallest 3D Stacked FET at VLSI Symposium for AI/HPC, Boosting Performance and Power Efficiency
MK South Korea Overview Samsung Electronics presented groundbreaking research on the industry's smallest "3D stacked FET" technology at the 2026 VLSI Symposium, earning the Best Paper award among over 1,000 submissions. This innovative a... -
Samsung Electronics Leads Advanced Packaging with Projected Triple HBM Sales and Thinnest 0.65mm LPDDR DRAM Package Development
Simply Wall St South Korea Overview Samsung Electronics is leading advanced packaging advancements by leveraging extensive in-house expertise to streamline production cycles and reduce lead times. The company projects its High Bandwidth ... -
Glass Substrates: The Next Frontier in AI Packaging and the Race to Mass Production
The Economy South Korea Overview Glass substrates are rapidly emerging as a transformative technology in advanced AI chip packaging, poised to replace conventional organic substrates and silicon interposers by offering superior dimension... -
NVIDIA Locks Down Multi-Year HBM Supply Deals, Anticipating Persistent Shortages Beyond 2028
gagadget.com USA Overview NVIDIA CEO Jensen Huang recently visited South Korea, securing multi-year agreements with key partners including SK Hynix, SK Telecom, Naver, and Doosan Group for High Bandwidth Memory (HBM) supply, AI cloud inf... -
Samsung to Establish Gwangju Advanced Packaging Facility, Eyes Full HBM Hybrid Bonding Transition by 2029
TrendForce South Korea Overview Samsung Electronics is reportedly considering a new advanced semiconductor packaging plant in Gwangju, South Korea, with investment plans potentially announced by June 2026. This strategic facility will fo...
