Silicone– tag –
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Low-Stress Mold Compounds Evolve to Protect Fragile Components in Advanced Semiconductor Packages
Global Semiconductor Global Overview Modern low-stress molding technologies encompass diverse material compositions, including silicone-based compounds and modified epoxies with flexible segments. These compounds have evolved to address ... -
Shin-Etsu Silicones Unveils Next-Gen Raw Materials for Enhanced Cosmetic Textures and Soft-Focus Effects at In-Cosmetics Global
Global Cosmetic Industry Japan Overview Shin-Etsu Silicones Europe B.V. showcased a new generation of high-performance silicone raw materials at in-cosmetics Global 2026. Key launches included KF-6070W, a water-soluble silicone wax for s... -
Novel Silicone-Free Hybrid TIM Achieves Stable Low Thermal Resistance Under Harsh Conditions for Power Modules
PatSnap Eureka USA Overview Research from PatSnap Eureka reports on a novel thermal interface material (TIM) optimized for power modules operating under harsh temperature and humidity. The proposed material, a silicone-free epoxy-polysil... -
Yousan New Materials Unveils High-Performance Non-Silicone Thermal Interface Pads for AI Chips and Servers
Yousan New Materials China Overview Yousan New Materials has launched a new line of non-silicone thermal interface pads with thermal conductivities ranging from 2.0 to 10.0 W/m·K, specifically engineered for AI chips, servers, and high-p... -
Forza Unveils HyPer Polymer™ SMP Adhesive for Low-VOC Industrial Bonding, Advancing Sustainability and Performance
SpecialChem France Overview Forza has launched HyPer Polymer™, a novel silyl-modified polymer (SMP) adhesive designed for industrial bonding applications, offering a sustainable alternative to traditional polyurethane and silicone system... -
Henkel Unveils Silicone-Free Thermal Gap Filler and High-Strength Conductive Adhesive for Advanced EV Battery Thermal Management
Henkel Germany Overview Henkel has introduced two new thermal interface materials designed to enhance EV battery thermal management: the Bergquist TGF 2030APS gap filler, which is silicone-free with a thermal conductivity of 1.7 W/m·K, a...
