Sumitomo– tag –
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Apple Unveils 2nm iPhone 18; Samsung Cuts Thermal Resistance by 16% with Encapsulant and TIM Innovations, Intensifying Competition with TSMC
BigGo Finance South Korea Overview Following Apple's announcement of the 2nm iPhone 18, Samsung Electronics and TSMC are intensifying their competition in next-generation semiconductor packaging and thermal management. Samsung has achiev... -
Sumitomo Bakelite Unveils Novel Low-Stress Epoxy Compound for Next-Gen 2.5D/3D Packaging
SEMI Europe Conference News Japan Overview Sumitomo Bakelite has announced a groundbreaking epoxy molding compound (EMC) at SEMI Europe, specifically engineered for the intricate demands of 2.5D and 3D advanced packaging solutions. This ... -
Sumitomo Bakelite Hits Record ¥305 Billion Sales, Riding High on AI Silicon Encapsulant Demand
The Shashi Japan Overview Sumitomo Bakelite Co., Ltd. has announced a record-high ¥305 billion ($2.0 billion USD) in consolidated sales for FY2025, primarily propelled by a robust recovery and growth in its encapsulant materials business... -
Sumitomo Bakelite Realigns 2026 CapEx to Asian Fabrication Nodes as 35.7% Operating Profit Expansion Signals Structural De-commoditization in Semiconductor Encapsulation Materials
HDIN Research Japan Overview Sumitomo Bakelite has announced a strategic realignment of its 2026 capital expenditures, focusing on semiconductor encapsulation material manufacturing sites in Asia. The company reported a significant 35.7%... -
Sumitomo Bakelite Unveils Advanced Encapsulation Materials for Automotive Power Semiconductors, Boosting EV/HEV Safety and Efficiency
Automotive Electronics World Japan Overview Sumitomo Bakelite has announced new advanced encapsulation materials designed to enhance the reliability of automotive power semiconductors for Electric Vehicles (EVs) and Hybrid Electric Vehic... -
PatSnap Eureka Report: Reducing Voiding in Chip Embedding Epoxies Critical for High-Reliability Systems in Automotive and Aerospace
PatSnap Eureka Global Overview A PatSnap Eureka report identifies reducing voiding in chip embedding epoxies as a critical reliability challenge in high-performance electronic packaging, particularly for automotive and aerospace systems.... -
Sumitomo Bakelite Develops G785 Series High-Tg Epoxy Molding Compounds with Industry-Leading 230°C Tg for Next-Gen SiC Power Modules
Sumitomo Bakelite Co., Ltd. Japan Overview Sumitomo Bakelite has developed the 'G785 Series' of high-Tg epoxy molding compounds for next-generation SiC power modules, achieving an industry-leading glass transition temperature (Tg) of 230... -
Sumitomo Chemical Unveils ‘ELA Series’ High-Purity Alumina for Advanced Semiconductors
AL Circle Japan Overview Sumitomo Chemical has launched the ELA Series, a new range of high-purity alumina products targeting advanced semiconductor manufacturing for AI and high-performance electronics. This series represents the world'... -
Sumitomo Chemical Develops New Ultra-Low Alpha, High-Thermal-Conductivity Alumina Filler for Advanced Semiconductors
住友化学 Japan Overview Sumitomo Chemical has developed a new 'ELA series' of high-purity alumina, boasting extremely low alpha-particle emissions and enhanced thermal conductivity, specifically for advanced semiconductors. This innovati... -
Sumitomo Bakelite Announces Price Increase for Semiconductor Encapsulation Epoxy Molding Compounds
住友ベークライト株式会社 Japan Overview Sumitomo Bakelite has announced a price revision for its SUMIKON™ EME series of epoxy resin molding compounds for semiconductor encapsulation, effective June 1, 2026, with increases ranging from 10...
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