Key Findings
German semiconductor manufacturer Infineon Technologies has announced a significant strengthening of its partnerships for advanced packaging technology development within the European Union, under the framework of the EU Chips Act. This move represents a crucial step for Europe’s semiconductor industry to establish strategic autonomy and enhance international competitiveness amidst the global restructuring of semiconductor supply chains. Infineon will specifically focus on chiplet technology and heterogeneous integration, deepening collaboration with research institutions, universities, and other companies within the EU. This enhanced cooperation aims to secure a stable supply of high-performance semiconductors required in key sectors such as automotive, industrial control, and power management, thereby reducing external dependencies.
Technical and Collaboration Details
Infineon’s focus areas in advanced packaging technology include:
- Chiplet Technology: Combining small chips (chiplets) with different functionalities and integrating them into a single package. This contributes to design flexibility, cost efficiency, and performance improvement.
- Heterogeneous Integration: Integrating different types of semiconductors, such as logic, memory, sensors, and RF, into one package to achieve system miniaturization and enhanced functionality.
- SiP (System-in-Package) Solutions: Integrating multiple functional blocks into a single package to achieve system miniaturization, higher performance, and lower power consumption.
- Advanced Interconnection Technologies: Miniaturization technologies such as hybrid bonding, micro-bump connections, and RDL (Redististribution Layer).
These technological developments are closely linked to strengthening mass production capabilities at manufacturing sites within Europe, aiming to complete the entire value chain from R&D to production within the EU. Infineon will leverage its expertise in power semiconductors and automotive semiconductors into the advanced packaging sector.
Background and Industry Context
Rising geopolitical tensions and supply chain disruptions caused by the COVID-19 pandemic have prompted countries worldwide to encourage the repatriation or regionalization of semiconductor manufacturing capabilities. The EU Chips Act aims to double the EU’s share of global semiconductor production to 20% by 2030, mobilizing over 43 billion euros (approximately 6.8 trillion JPY) in public and private investment. Infineon’s announcement aligns with this large-scale strategy, aiming for semiconductor self-sufficiency, particularly in the automotive and industrial sectors where Europe has strong capabilities.
Strategic Significance and Outlook
Infineon’s initiative will accelerate the development of an advanced packaging technology ecosystem in Europe, playing a critical role in enhancing the overall competitiveness of the region’s semiconductor industry. In the future, this collaboration is expected to generate new innovations, further strengthening Europe’s technological leadership in areas such as autonomous driving, renewable energy, and smart factories. Through these technologies, Infineon aims to contribute to the realization of a more sustainable and intelligent society.
Source: #
Get our weekly technology intelligence — free
Receive an infographic that lets you judge at a glance whether each field’s analysis report is worth reading.
Subscribe Free — Weekly Tech Intelligence
By subscribing, you’ll receive Troy-Technical’s weekly technology intelligence newsletter.
- Your email and selected fields are used only to deliver the newsletter.
- We never share your information with third parties.
- You can unsubscribe anytime via the link in each email.
See our Privacy Policy for details.
Takes about a minute · Unsubscribe anytime
Comments