August 2026– date –
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Sumitomo Bakelite and Mitsubishi Chemical Raise Packaging Material Prices for CoWoS and HBM Amid Surging Demand
Global Times China Overview Increasing demand for advanced processes and packaging, coupled with rising energy and raw material costs from Middle East conflicts and China's tightened export controls on strategic minerals, is disrupting h... -
Morgan Stanley Taps Samsung Electro-Mechanics as Top Korean Tech Pick Amid Surging AI Chip Substrate Demand
Evrim Ağacı Turkey Overview Morgan Stanley has elevated Samsung Electro-Mechanics to its premier Korean tech stock, citing the escalating technical demands of AI chip designs on advanced substrates. As AI processors become larger, multi-... -
TSMC CoWoS and ABF Substrate Supply Bottlenecks Threaten AI Chip Production Amid $265B Market Opportunity
Silicon To Software USA Overview For leading AI accelerators, wafer manufacturing capacity is not the only constraint; CoWoS advanced packaging and ABF (Ajinomoto Build-up Film) substrate qualification cycles are also limiting production... -
Japan’s Shinko Electric Develops 22-Layer Glass Substrates for AI Chips, Resolving Internal Cracking and Delamination Issues
TrendForce Japan Overview As AI chips demand larger packages, intensifying competition in glass substrates, Japan's Shinko Electric Industries has successfully developed 22-layer glass substrates with 11 copper wiring layers on each side... -
STMicroelectronics Maintains $2 Billion Investment Amid Net Loss, Bolstering SiC, 300mm Fabs, and Advanced Packaging
Seeking Alpha Switzerland Overview Despite reporting a net loss in the first half of 2026, STMicroelectronics (STM) plans to maintain its net capital expenditure near the upper end of the $2-2.2 billion range for the year, focusing on Si... -
Fraunhofer IKTS Achieves Real-Time Detection of 8µm Packaging Seal Defects Using Optical Coherence Tomography (OCT)
Fraunhofer-Gesellschaft Germany Overview Researchers at Fraunhofer IKTS have developed an innovative inspection system based on Optical Coherence Tomography (OCT), successfully enabling continuous, real-time, and non-destructive detectio... -
Semiconductor Inspection Equipment Market to Reach $13.4 Billion by 2034, KLA Leads in Advanced Packaging Process Control
Exponential Industry USA Overview The semiconductor inspection equipment market is projected to grow at a 7.9% CAGR from 2026 to 2034, reaching $13.4 billion, driven by increasing AI chip complexity and advanced packaging adoption. KLA i... -
ABF Substrate Shortages Projected Through 2028 Amid AI Boom; Taiwanese, Japanese, Korean Manufacturers Secure Orders Until 2030
digitimes Taiwan Overview The global AI computing infrastructure boom is rapidly escalating demand for GPUs, CPUs, and ASICs, leading to projected ABF (Ajinomoto Build-up Film) substrate shortages starting in 2026 and worsening through 2... -
SK Hynix Breaks Ground on $3.87 Billion Advanced Packaging Plant in Indiana for HBM Production
The Korea Herald South Korea Overview SK Hynix is set to hold a groundbreaking ceremony this month for a $3.87 billion advanced chip packaging plant in Indiana, intensifying its U.S. presence in AI chip production. The facility, near Pur... -
Applied Materials Raises Advanced Packaging Revenue Forecast to Over 70% Growth on AI Demand, Unveils New HBM Systems
TrendForce USA Overview Applied Materials has significantly revised its advanced packaging revenue forecast for 2026 to over 70% year-over-year growth, a 20-percentage-point increase in just three months, driven by soaring AI semiconduct...
