August 2026– date –
-
JEDEC Relaxes HBM4 Package Height to 775 µm, Enabling 12-Hi/16-Hi Stacks Without Immediate Cu-Cu Hybrid Bonding
Exponential Industry USA Overview JEDEC has relaxed the HBM4 package height specification from 720 µm to 775 µm, allowing for 12-Hi and 16-Hi stack HBM modules without immediate reliance on Cu-Cu hybrid bonding. HBM utilizes 3D stacked D... -
Applied Materials Reports $9.12 Billion in Q3 2026 Revenue, Plans to Double Semiconductor Systems Output by 2028 Amid Surging Demand
GlobeNewswire USA Overview Applied Materials announced Q3 2026 revenue of $9.12 billion, marking a 25% year-over-year increase and slightly exceeding market expectations. The company maintains strong leadership and a pipeline of innovati... -
KLA Forecasts $1.1 Billion in Advanced Packaging Revenue for 2026, Driven by Surging AI and HBM Demand
Quartz USA Overview KLA Corporation anticipates its advanced packaging business revenue will reach approximately $1.1 billion in 2026, representing over 70% year-over-year growth, fueled by increasing AI infrastructure investments and se... -
Ibiden Commits ¥500 Billion to ABF Substrates for AI Servers, Anticipating Supply Crunch Beyond 2028
MK Japan Overview Ibiden, the world's leading AI substrate manufacturer, announced a ¥500 billion investment from this year to 2028 to expand production capacity for IC package substrates for AI and high-performance servers. Despite long... -
AI Demand Strains CoWoS and SoIC Supply: Global Demand to Double to Over 2.5M Wafers by 2027, Facing 10-20% Shortfall
Exponential Industry USA Overview TSMC's CoWoS and SoIC advanced packaging technologies are now the primary physical constraints for AI GPU and accelerator production. Global CoWoS demand is projected to double from 1.3-1.4 million wafer... -
NVIDIA Accelerates Feynman AI Platform; TSMC Ramps SoIC Capacity to 50K Wafers/Month by 2027
Benzinga Taiwan Overview NVIDIA is expediting the roadmap for its next-generation Feynman AI platform, prompting TSMC to significantly boost its advanced packaging capabilities. TSMC is rapidly expanding its SoIC technology production, a... -
TSMC Achieves Over 98% CoWoS Yield; ABF Substrates Emerge as Next Bottleneck for AI Chip Expansion
Xenospectrum Taiwan Overview TSMC has announced that its advanced CoWoS packaging technology, particularly for 5.5x reticle AI chip products, consistently achieves yields exceeding 98%. While CoWoS capacity has doubled annually for three... -
Xcellon Biologics Acquires NextCure GMP Facility, Establishes End-to-End CRDMO for Next-Gen Bioconjugates, Streamlining Development from Discovery to Clinical Supply
Outsourced Pharma USA Overview Xcellon Biologics has acquired a GMP manufacturing facility from NextCure, transforming into an end-to-end Contract Research, Development, and Manufacturing Organization (CRDMO) for next-generation bioconju... -
Korro Bio Accelerates RNA Editing Platform into Clinic with First-in-Human Trial for Hyperammonemia and Designation of AATD Candidate
GlobeNewswire (via Korro Bio, Inc.) USA Overview Korro Bio has announced plans to initiate first-in-human clinical trials for its hyperammonemia treatment candidate, KRRO-121, in late 2026. Concurrently, the company designated KRRO-111 a... -
ProQR Therapeutics Marks Landmark: Axiomer RNA Editing Platform Achieves First Clinical Validation for Cholestatic Liver Disease Therapy
Quartr Sweden Overview ProQR Therapeutics has reported the first clinical validation of its proprietary Axiomer RNA editing platform, achieved through Phase 1 target engagement data for AX-0810. This candidate demonstrated modulation of ...
