Key Findings
In the high-power packaging sector, die attach solder paste has been highlighted as playing an exceptionally critical role as a key material. These pastes achieve superior thermal conductivity, ranging from 60-70 W/m·K (and exceeding 70 W/m·K with the addition of copper/nickel reinforcing phases), demonstrate very high bond strength, enable precise gap filling capabilities, and offer broad environmental adaptability. Notably, these tin-alloy-based pastes possess groundbreaking potential to significantly reduce chip junction temperatures in IGBT (Insulated Gate Bipolar Transistor) packaging, potentially from 125°C to 105°C, thereby extending module lifespan.
Technical / Clinical Details
The evolution of die attach solder paste is particularly characterized by the following technological advancements:
- High Thermal Conductivity: While standard solder pastes offer thermal conductivity of 60-70 W/m·K, the addition of reinforcing phases such as copper (Cu) and nickel (Ni) can achieve thermal conductivities exceeding 70 W/m·K. This allows for efficient heat dissipation from high-heat-generating devices, suppressing device temperature rise, and improving performance and reliability.
- High-Strength Bonding: Provides robust mechanical bonding between the chip and substrate, enhancing durability against thermal cycling and mechanical shock. This maintains device stability even under harsh operating conditions.
- Precise Gap Filling and Void-Free Performance: Ultra-fine metal powders and optimized low-viscosity formulations enable precise and uniform gap filling while suppressing the formation of voids, even in very narrow spaces. This is particularly crucial for devices requiring extremely high precision, such as solid-state LiDAR emitter modules. Void reduction maximizes heat transfer efficiency and prevents hot spot formation.
- Reduced Chip Junction Temperature: In IGBT packaging, it has been demonstrated that chip junction temperatures can be significantly reduced, for example, from 125°C to 105°C, compared to conventional bonding technologies. This directly contributes to reducing thermal stress and extending the long-term reliability and lifespan of modules.
- Environmental Adaptability: Formulations compliant with lead-free standards and other environmental regulations are being developed, meeting the requirements for green electronics.
These properties are indispensable in applications demanding high power and high reliability, such as electric vehicles, renewable energy, and industrial control systems.
Background & Context
The rapid development of fields such as electric vehicles (EVs), 5G/6G communication, data centers, and industrial power electronics demands increasingly higher power density and reliability from semiconductor devices. Consequently, efficient management of the heat generated within devices has become the greatest challenge for maintaining performance and extending lifespan. As die attach materials form one of the first and most critical layers in the heat transfer path from the chip to the heatsink, improving their performance is essential for supporting technological innovation in these industries. The balance between thermal conductivity and reliability, which was difficult with conventional bonding technologies, is now becoming possible through the evolution of solder pastes.
Strategic Significance & Outlook
The continuous evolution of high thermal conductivity die attach solder pastes will further push the performance and reliability of high-power packaging. These materials are expected to play an indispensable role in applications where heat generation is a critical bottleneck, such as EV inverters, charging stations, AI servers, and high-performance LED lighting. The widespread adoption of pastes with thermal conductivities exceeding 70 W/m·K will further lower device operating temperatures, enable operation at higher current densities, and ultimately contribute significantly to the development of next-generation electronics by improving system efficiency and lifespan.
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