MIT/NY CREATES Develops 300mm Process for Flexible, Transparent Silicon Photonics; Counterpoint Predicts NPO to Outpace CPO in Adoption

September 13, 2026

Semiconductor Engineering USA

Overview

Researchers at MIT and NY CREATES have developed a 300mm manufacturing process for flexible, transparent silicon photonics using standard semiconductor techniques. While optical chiplets offer a promising way to overcome the bandwidth, power, and reach limitations of copper interconnects, integrating photonics into advanced packages proves more challenging than simply switching signal media. A Counterpoint report indicates that the transition to optical connectivity is accelerating, with Near-Packaged Optics (NPO), next-generation pluggables, and multicore fiber likely to see broader adoption than Co-Packaged Optics (CPO).

In Depth

Key Findings

Researchers from MIT and NY CREATES have achieved a significant milestone by developing a 300mm manufacturing process for flexible and transparent silicon photonics, utilizing standard semiconductor fabrication techniques. This breakthrough opens new avenues for optical technology applications. Concurrently, a report from Counterpoint suggests that as the shift towards optical connectivity accelerates, Near-Packaged Optics (NPO), next-generation pluggable modules, and multicore fiber are poised for broader adoption compared to Co-Packaged Optics (CPO).

Technical / Clinical Details

The 300mm manufacturing process developed by MIT and NY CREATES is directly compatible with existing semiconductor foundry infrastructure, paving the way for high-volume production of flexible and transparent silicon photonics devices. This technology has implications not only for optical communication but also for applications in wearable devices, biosensors, and other innovative fields. Optical chiplets are recognized as a crucial solution to overcome the inherent physical limitations of traditional copper interconnects, particularly concerning bandwidth, power consumption, and reach. However, integrating photonics into advanced packaging involves complex technical challenges beyond mere signal medium replacement, such as precise optical alignment, thermal management, and interactions between disparate materials. Counterpoint’s market research highlights that NPO, enhanced pluggable optical modules, and multicore fiber (MCF) are likely to gain market traction faster than CPO, citing factors such as ease of adoption, cost-effectiveness, and maturity as key drivers.

Background & Context

The escalating growth of AI workloads exacerbates data transmission bottlenecks within data centers and computing systems. Increasing power consumption and maintaining signal integrity are primary challenges impeding the sustainable scaling of AI infrastructure. Optical communication technology is widely regarded as the most promising solution to these challenges. Silicon photonics, owing to its high integration density and compatibility with semiconductor manufacturing processes, is highly anticipated as a foundational technology for next-generation optical interconnects. While technologies like CPO offer high performance, their complex integration processes and associated costs can pose barriers to mass production. NPO and next-generation pluggables are gaining attention as practical steps that improve performance and reduce power consumption while maintaining compatibility with existing infrastructure.

Strategic Significance & Outlook

The development of a 300mm manufacturing process for flexible and transparent silicon photonics significantly expands the scope of optical technology, potentially creating entirely new product categories. Simultaneously, while the transition to optical connectivity is expected to continue accelerating, Counterpoint’s forecast that the market may prioritize more incremental solutions like NPO, next-generation pluggables, and MCF over CPO offers critical insight for shaping short-to-medium-term market strategies. This suggests that market adoption will be influenced by a combination of factors, including technical feasibility, economic viability, compatibility with existing infrastructure, and ease of deployment. These trends will play a crucial role in shaping the future of high-speed, low-power data communication in the AI era.

Source: https://semiengineering.com/chip-industry-week-in-review-167/

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