September 2026– date –
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Krayden Delivers Advanced Material Solutions for Flip Chip BGA to Enhance Interconnect Density, Thermal Paths, Warpage Control, and Reliability
Krayden USA Overview Krayden provides comprehensive material solutions addressing critical challenges in Flip Chip Ball Grid Array (FCBGA) packages, including interconnect density, thermal path design, package warpage, and long-term reli... -
Indium Corporation Showcases High Thermal Conductivity TIMs and Sintering Pastes for AI at SEMICON Taiwan
Indium Corporation USA Overview Indium Corporation exhibited innovative materials supporting AI technology at SEMICON Taiwan, highlighting Heat-Spring® compressible metal TIMs and solder TIMs for superior thermal conductivity in high-pow... -
MDPI Review Compares Advanced Semiconductor Packaging: Spotlighting Thermal Management and Reliability Challenges
MDPI Switzerland Overview A review paper published in MDPI critically compares advanced packaging architectures, including 2D, 2.5D, and 3D integration, detailing challenges in thermal management, warpage from thermomechanical mismatch, ... -
AI Technology Unveils Enhanced Thermal Dissipation Molding Underfill for HBM and 3D DRAM to Boost Package Reliability
AI Technology, Inc. USA Overview AI Technology, Inc. (AIT) has announced a new Molding Underfill (MUF) with significantly enhanced thermal dissipation, targeting advanced semiconductor packaging like HBM, 3D DRAM, and AI processors. This... -
Hical Technologies Launches India’s First Indigenous Coreless BLDC Motor for Space Applications, Adopted for Satellite Attitude Control Systems
Bisinfotech India Overview Hical Technologies has announced the commercial launch and first customer delivery of India's indigenous coreless Brushless DC (BLDC) motor for space applications. This motor was specifically developed for sate... -
Microchip Technology Unveils Space CSAC-SA65 Radiation-Hardened Chip-Scale Atomic Clock for Low-Power, High-Precision Timing, Simplifying Satellite Design and Reducing Costs
Simply Wall St USA Overview Microchip Technology has announced the "Space CSAC-SA65," a radiation-hardened chip-scale atomic clock offering precise, low-power timing for satellite electronics operating in harsh environments like Low Eart... -
Spirit Electronics Launches Online Direct Sales of Texas Instruments and Microchip Technology Space-Grade Components to Meet Rising Demand for Radiation-Hardened Electronics
Burn and Coast - The launch USA Overview Spirit Electronics announced the launch of online direct sales for space-grade and high-reliability components from Texas Instruments and Microchip Technology, effective August 24, 2026. This init... -
Infineon and NASA Integrate Component-Level Radiation-Hardened Power Semiconductors into Nancy Grace Roman Space Telescope
Electronics USA USA Overview Infineon Technologies AG and NASA have equipped the Nancy Grace Roman Space Telescope with radiation-hardened power semiconductor components, designed to resist radiation degradation at the component level. T... -
Hainan Island Unveils China’s First Commercial Spaceport, Set to Propel Private Sector Growth
People's Daily Online China Overview China's inaugural dedicated commercial space launch site on Hainan Island, the Hainan Commercial Space Launch Site, is preparing for its first rocket launches and is slated to commence commercial oper... -
Galactic Energy Successfully Launches PALLAS-1 Medium-Lift Liquid-Fueled Rocket, Targeting 5-7 Ton LEO Payloads with 25+ Reuses
FriendsofNASA.org (via Facebook) China Overview Chinese private space company Galactic Energy successfully completed the maiden flight of its PALLAS-1 medium-lift liquid-fueled rocket on September 1, 2026. Designed for medium-weight payl...
