September 2026– date –
-
Moldex3D Compression Molding Simulation Achieves Semiconductor Package Defect Prediction and Quality Enhancement
Rheologist gaze & solutions (Moldex3D) Taiwan Overview Moldex3D provides CAE simulation tools for compression molding processes in advanced semiconductor packaging, enabling precise simulation of how encapsulating materials like epoxy mo... -
Master Bond Offers Eco-Friendly Solvent-Free, Halogen-Free, RoHS-Compliant Adhesive and Encapsulation Solutions
Master Bond USA Overview Master Bond offers a wide range of solvent-free, halogen-free, RoHS-compliant, and energy-efficient adhesives, sealants, coatings, potting, and encapsulation compounds, emphasizing reduced environmental impact. N... -
Advanced Die Attach Solder Paste for High-Power Packaging: Achieving >60-70 W/m·K Thermal Conductivity and Precision Filling
Global SMT & Packaging Global Overview A Global SMT & Packaging article emphasizes the critical role of die attach solder paste in high-power packaging, achieving excellent thermal conductivity of 60-70 W/m·K (and >70 W/m·K with C... -
Tom’s Hardware Reports: TSMC Achieves 6-Micron Hybrid Bonding, Full HBM Integration Potentially Delayed to HBM4E/HBM5 (2027-Late 2020s)
Tom's Hardware USA Overview Tom's Hardware reports on the 2026 status of hybrid bonding, revealing TSMC's SoIC achieves 3.5D integration by combining hybrid-bonded stacks with CoWoS modules on silicon interposers, reaching 6-micron preci... -
P Equity Research Analyzes Advanced Semiconductor Packaging: Illuminating the Roles of Underfill and Mold in 2.5D and CoWoS Architectures
P Equity Research Global Overview A P Equity Research article delves into advanced semiconductor packaging, including 2.5D and CoWoS architectures, detailing the crucial role of adhesives and encapsulants when processors and memory layer... -
Master Bond Offers High-Strength, High-Reliability Die Attach Epoxy Adhesives for Microelectronics
Master Bond USA Overview Master Bond provides die attach epoxy adhesives for microelectronic semiconductor packaging and chip-on-board assemblies, featuring high bond strength, thermal cycling resistance, mechanical shock/vibration resis... -
Master Bond Offers Epoxy Underfill Formulations to Boost Reliability for Flip-Chip and CSP Assemblies
Master Bond USA Overview Master Bond provides epoxy underfill formulations designed to significantly enhance the long-term reliability of flip-chip and chip-scale packaging (CSP) assemblies. These materials achieve excellent adhesion to ... -
Saint-Gobain Offers High-Performance Adhesives and Bonding Tapes, Including PFAS-Free Alternatives, for EV Battery Applications
Saint-Gobain France Overview Saint-Gobain provides comprehensive high-performance adhesive and bonding tape solutions, gasket foams, spacer tapes, and specialty films for demanding industries like electronics, energy, aerospace, and espe... -
Henkel Unveils Loctite ABLESTIK CDF900 Series Conductive Die Attach Film with >8 W/m-K Thermal Conductivity for AI and HPC Packages
SpecialChem Germany Overview Henkel Adhesive Technologies has introduced the new Loctite ABLESTIK CDF900 series conductive die attach film (cDAF), revolutionizing advanced packaging for AI accelerators and HPC processors. This innovative... -
Krayden Supplies High Thermal Conductivity Hysol GR60 Series EMC for IPMs, Enhancing Reliability of Automotive and Industrial Modules with 2.2 W/mK
Krayden USA Overview Krayden offers advanced encapsulation solutions for Intelligent Power Modules (IPMs), featuring Hysol GR60 series epoxy mold compounds (EMC) with superior thermal conductivity. The GR60 HT variant achieves a thermal ...
