September 2026– date –

ScienceDaily (Caltech) USA Overview Researchers at Caltech have developed a novel miniature chip capable of redirecting a light beam in an astonishing 74 femtoseconds (74 quadrillionths of a second). This breakthrough utilizes a nanoscal...

The Debrief News Japan Overview Researchers at Osaka University have made a breakthrough in self-healing materials, identifying a specific metal alloy capable of spontaneously repairing micro-cracks. This innovation extends the concept o...

Technology Innovation Institute (TII) UAE Overview The Technology Innovation Institute's Advanced Materials Research Center (AMRC) has developed an innovative phase change material (PCM) based thermal energy storage solution, offering a ...

3D InCites USA Overview Indium Corporation experts will present advanced materials solutions for advanced packaging, AI, and high-performance computing (HPC) at the IMAPS Symposium. Solutions include ultra-low residue flux for micro-bump...

SEMI USA Overview Four finalists from SEMI Startups for Sustainable Semiconductors presented groundbreaking innovations at SEMICON West 2026. HEXAspec Inc. achieved a 10x improvement in thermal conductivity with hBN nanosheet-polymer enc...

Brewer Science USA Overview Brewer Science will present new data at IMAPS 2026 on a high-temperature-stable laser release material, designed for advanced packaging processes from 250°C to 350°C. This material supports demanding processes...

YINCAE (via Electronics Media) USA Overview YINCAE unveiled its UV-curable underfill technologies, UF 66UV and UF 88UV, at IMAPS 2026. UF 66UV offers high-speed processing and robust reliability for advanced electronic packaging. Notably...

3D InCites Germany Overview Heraeus has unveiled a new approach to scalable silver sintering for next-generation power modules, addressing the critical challenge of balancing throughput with precision. By optimizing precise paste deposit...

Pulse 2.0 USA Overview L&L Products has introduced Toughened T-Link, an amorphous thermoplastic adhesive designed to enhance the performance of laminated epoxy carbon-fiber composites. Internal testing showed that composite panels in...

Henkel Adhesive Technologies Germany Overview Henkel has launched Teroson MS 940, a high-performance isocyanate-free adhesive and sealant for rail and industrial applications. This new product surpasses the mechanical performance of stan...