Key Findings
MacDermid Alpha will showcase BondPad at electronica 2026 (November 10–13 in Munich), a solution designed for sintered die-topside attach in high-power SiC packages. In power-cycling tests conducted at 180A with a 110°C temperature swing and a maximum junction temperature of 175°C, BondPad achieved more than 75,000 cycles. This compares to 2,500 cycles for standard conventional aluminium wirebond references, representing approximately 30 times longer life based on a 5 percent increase in drain-to-source voltage as the failure criterion.
Technical Details
The BondPad solution integrates a 50 µm nominal copper foil with a proprietary Argomax silver sinter film. During the sintering process, the Argomax layer creates a metallurgical bond with the die topside, resulting in a consistent sintered bond line of approximately 20 µm. The exposed copper surface then serves as a landing area for subsequent copper wire or copper ribbon bonding.
Compared to silver sinter paste-based methods, the film-based approach provides several technical advantages:
- Control of bond line thickness.
- Elimination of print and dispense dimensional variability.
- Reduction in overall processing time.
Background and Context
As SiC power devices enable higher operating temperatures and switching frequencies, the industry is shifting away from conventional solder and aluminium wire-bonding. Manufacturers are increasingly adopting sintered die attach and die-topside interconnects to withstand demanding thermal-cycling conditions. BondPad is designed to simplify this transition by supporting machine placement from tape-and-reel, allowing for automated assembly using established wire-bonding equipment.
Significance and Outlook
By extending silver sintering technology to the die-topside interconnect, MacDermid Alpha aims to improve power module reliability and process control as power density increases. Alongside BondPad, the company is exhibiting other sintering and solder products, including ALPHA ARGOMAX AccuLam 8022 silver sintering film for die attach and ALPHA TrueHeight Solder Preforms for bond line control.
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