Key Findings
NVIDIA’s Spectrum-X Ethernet CPO (Co-Packaged Optics) switches have entered mass production, marking the first mass-produced 200G/lane CPO switch system. Foxconn (Hon Hai Technology Group) is the primary partner for system design, integration, and mass production, with Industrial Futuristic (FII) acting as the direct order recipient. Foxconn has established automated production lines for fiber alignment, assembly, and testing to transition CPO manufacturing from laboratory settings to industrial scale.
Technical Specifications
The switches are based on the Spectrum-6 chip, delivering a maximum single-chip bandwidth of 102.4Tb/s. Utilizing TSMC’s 4nm silicon photonics and 3D advanced packaging, the system achieves the following performance improvements over previous generations:
- Laser count reduced by 4 times.
- Total power consumption reduced by 5 times.
- Mean Time Between Interrupts (MTBI) improved by 10 times.
- Optical signal loss reduced from 22dB to 4dB.
- Signal integrity improved by 64 times.
Liquid Cooling Architecture
The Spectrum-X CPO switches, specifically the SN6810-LD and SN6800-LD models, utilize a full liquid-cooling design with 100% coverage from the CPO chip to the optical modules. The SN6800-LD employs four Spectrum-6 ASICs with a maximum power consumption of approximately 10.5kW. The cooling system includes cold plate modules for the switch chip and integrated optical modules, stainless steel corrugated pipes, distribution manifolds, and high-precision quick-connect joints.
Supply Chain and Market Outlook
The product was jointly developed by TSMC, Lumentum, Silicon Labs, TFC (Tianyuan Communication), and Foxconn, with early commercial adoption by CoreWeave, Lambda, and Oracle. Within the liquid cooling supply chain, AVC (Asia Vital Components) holds the core supply share for cold plate modules, with Cooler Master holding a smaller portion. NVIDIA has revised its shipment targets for 2026–2027 upward from 10,000 to 50,000 units, creating a dedicated demand for 50,000 sets of CPO-specific liquid cooling systems.
Source: https://hao.cnyes.com/post/275823
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