2026– date –
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Rapidus 2nm: AI-driven custom chip manufacturing roadmap
Excite Japan Overview Japan's 2nm short Turnaround Time (TAT) semiconductor manufacturing market is being shaped by Rapidus's unique model. The Rapidus 2nm program integrates advanced Gate-All-Around (GAA) technology, single-wafer proces... -
Hybrid Bonding: Imec and EV Group 200nm demo explained
Tara Minunilor Belgium Overview Hybrid bonding, a semiconductor integration technology, directly connects dies or wafers with copper, bypassing traditional solder microbumps. Imec and EV Group demonstrated 200nm copper interconnect pitch... -
SK Hynix Hybrid Bonding: 90% yield and 3-year lifespan specs
The Economy South Korea Overview SK Hynix has stipulated stringent quality requirements for adopting hybrid bonding, a core technology for next-generation HBM manufacturing. The company demands a yield rate between 90% and 98% and a prod... -
ASE Technology: AI revenue growth and 17.8B TWD fab specs
Seeking Alpha Taiwan Overview ASE Technology Holding (ASX) reported a significant acceleration in revenue and margin growth, driven by surging advanced packaging demand for AI and HPC. Q2 2026 saw a 26.7% year-on-year revenue increase, w... -
Samsung & SK Hynix HBM4: Production timeline and 80% yields
Businesskorea South Korea Overview Samsung Electronics and SK hynix are accelerating HBM production schedules due to intensified supply-demand imbalance driven by expanding AI data center investments. Samsung plans to nearly double HBM4 ... -
Synopsys A14: TSMC multi-die design and UCIe 64G specs
The Register UK Overview Synopsys has expanded its advanced node design collaboration with TSMC, enhancing support for A14 design flows, AI-driven automation, and multi-die systems using CoWoS and Co-packaged optics. Key N2P milestones i... -
UCIe 3.0 explained: PCIe chiplet integration for AI and HPC
Verification Horizons USA Overview Universal Chiplet Interconnect Express (UCIe) 3.0 is transforming PCIe implementation by providing a standardized interconnect for optimized die-to-die communication in chiplet architectures. This enabl... -
Samsung HBM4: 2027 production specs and glass carrier volume
BigGo Finance South Korea Overview Samsung Electronics plans to at least double its HBM4 family production next year, with glass carrier outsourcing for cleaning expanding 2.5-fold from 20,000 to 50,000 wafers per month. HBM4 yield has s... -
TSMC CoWoS: 2028 capacity roadmap and production timeline
SemiWiki USA Overview TSMC plans to double its Chip-on-Wafer-on-Substrate (CoWoS) production capacity to 260,000 300mm wafers per month by 2028, up from 130,000 at the end of 2026. This aggressive expansion addresses the surging demand f... -
AlphaFold: 2,800+ AI viral protein structures explained
Mirage News International Overview AlphaFold has significantly expanded its database to include AI-predicted protein complex structures for over 2,800 viruses, prioritizing those known to infect humans, to enhance global pandemic prepare...
