DELO Unveils Ultra-Low Temperature Curing Adhesives for Consumer Electronics, Achieving Curing at 45°C for Enhanced Productivity and Component Protection

August 30, 2026

DELO News Germany

Overview

DELO has introduced a new generation of adhesives enabling ultra-low temperature (SLT) curing from just 45°C for consumer electronics assemblies, a significant reduction from conventional methods. Part of the DELO DUALBOND LT series, these products achieve rapid curing in 10 minutes at 60°C or 1 hour at 45°C, boosting productivity while safeguarding delicate components. This technology allows for inline heat tunnels as a viable alternative to batch ovens, setting a new standard for electronics manufacturing efficiency.

In Depth

Key Findings

DELO has unveiled a groundbreaking new generation of adhesives that enable ultra-low temperature (SLT) curing starting from just 45°C, specifically designed for consumer electronics assemblies. This technology offers a dual benefit by significantly boosting production efficiency while simultaneously protecting delicate electronic components from thermal stress.

Technical / Clinical Details

These newly introduced adhesives, forming part of the DELO DUALBOND LT series, are characterized by their ability to cure at exceptionally low temperatures. Specifically, they achieve full cure in just 10 minutes at 60°C, or exhibit sufficient strength within one hour at an even lower 45°C. This represents a substantial leap in production efficiency compared to conventional adhesives that typically demand higher temperatures or longer curing cycles. The ultra-low temperature curing minimizes the risk of thermal damage to sensitive electronic components such as MEMS sensors, camera modules, and OLED displays. This technology enables manufacturers to implement inline heat tunnels, offering superior space efficiency and processing speed compared to traditional batch oven methods. For high-volume production, common in consumer electronics, this translates into a proven dramatic improvement in production throughput.

Background & Context

The consumer electronics market is continuously driven by trends towards device miniaturization, multifunctionality, and intense cost competitiveness. Consequently, manufacturing processes are under pressure to deliver higher precision, efficiency, and flexibility. The increasing prevalence of heat-sensitive precision components has highlighted the limitations of conventional high-temperature curing processes. High temperatures can lead to performance degradation or warpage in components, resulting in lower yields and increased defect rates. DELO’s ultra-low temperature curing adhesives provide a direct solution to these challenges, alleviating manufacturing constraints, enhancing design freedom, and fostering new product innovations across the industry.

Strategic Significance & Outlook

DELO’s ultra-low temperature curing adhesives hold the potential to become a new standard in the manufacturing of a wide range of consumer electronic products, including smartphones, wearable devices, and IoT gadgets. The widespread adoption of this technology is expected to accelerate the realization of thinner, higher-performing, and more durable electronic devices. Furthermore, by contributing to reduced energy consumption in manufacturing processes, these adhesives also garner attention for their environmental benefits. DELO is positioned to continue developing innovative material solutions that meet market needs, thereby strongly supporting the evolution of the electronics industry and cementing its role as a key enabler of future technological advancements.

Source: https://www.delo-adhesives.com/news-and-dates/delo-news/detail/slt-adhesives-less-heat-more-speed/

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