Key Findings
Taiyo Holdings Co. Ltd. has unveiled its “FPIM Series,” a next-generation semiconductor-packaging material that has achieved the world’s first three-layer Redistribution Layer (RDL) formation with a 700-nanometer critical dimension (CD) on 12-inch wafers. This groundbreaking material is specifically designed for dual damascene processes, which are crucial for realizing fine-pitch wiring in advanced semiconductor packaging applications.
Technical / Clinical Details
The “FPIM Series” material enables the formation of extremely fine wiring patterns in advanced packaging technologies such as Fan-Out Wafer Level Packaging (FOWLP). The successful achievement of a 700nm CD three-layer RDL allows for high-density, high-performance chip interconnections that were previously challenging with conventional packaging technologies. RDLs play a vital role in establishing electrical connections between the chip and the external package, and their miniaturization directly translates to increased signal transmission speeds and reduced package sizes. This material has been developed through a collaborative research effort with imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, since October 2022. The synergy between imec’s advanced process capabilities and Taiyo Holdings’ material expertise was instrumental in this achievement. The detailed findings were presented at the 11th IEEE Electronics System-Integration Technology Conference, where its efficacy was validated by industry experts.
Background & Context
The rapid advancements in AI, 5G, and high-performance computing (HPC) demand semiconductor chips with higher performance, greater integration, and lower power consumption. While chip miniaturization has driven performance improvements in the past, it is approaching physical limits. Consequently, advanced packaging technologies, which efficiently connect multiple chips and components without further shrinking chip dimensions, have become the new frontier for the semiconductor industry. The miniaturization of RDLs is an indispensable technology for these advanced packaging methods, particularly FOWLP and 2.5D/3D packaging, enabling high-performance data processing and efficient power delivery.
Strategic Significance & Outlook
The “FPIM Series” is expected to make a significant contribution to the development of high-performance semiconductors used in next-generation smartphones, data center servers, and autonomous vehicles. The 700nm CD three-layer RDL formation technology pushes the current limits of semiconductor packaging performance, enabling further chip density and speed enhancements. Taiyo Holdings plans to continue deepening its collaboration with imec, leveraging this foundational technology to drive further innovations in semiconductor packaging materials. This strategic move is anticipated to further strengthen Japan’s technological leadership in material science within the global semiconductor supply chain, providing critical enablers for future digital advancements.
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