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Henkel Unveils Silicone-Free Thermal Gap Filler and High-Strength Conductive Adhesive for Advanced EV Battery Thermal Management
Henkel Germany Overview Henkel has introduced two new thermal interface materials designed to enhance EV battery thermal management: the Bergquist TGF 2030APS gap filler, which is silicone-free with a thermal conductivity of 1.7 W/m·K, a... -
Plexus Introduces Thermomechanical Polyurethane Adhesives for Integrated Thermal Management and Structural Bonding in EVs and Power Electronics
ITW Performance Polymers (Plexus) USA Overview Plexus has launched a new series of thermomechanical polyurethane structural adhesives, including the DT2630LD, designed to concurrently manage heat and provide robust structural bonding in ... -
Samsung Electro-Mechanics and Sumitomo Chemical Group Partner to Establish Glass Core Substrate Joint Venture
企業発表 South Korea Overview Samsung Electro-Mechanics and Sumitomo Chemical Group have signed an MOU to establish a joint venture for manufacturing "glass core" substrates, a critical material for next-generation advanced packaging. Ai... -
SK Hynix Validates 12-Die Hybrid Bonded HBM Stack Amidst Heated AI Memory Race
専門メディア South Korea Overview SK Hynix has successfully verified a 12-die HBM stack using hybrid bonding, demonstrating significant progress in its next-generation packaging technology for HBM4 and HBM5. While actively improving yiel... -
Samsung Electronics Pioneers HBM4 Mass Production with Hybrid Bonding, Solidifying Market Lead
専門メディア South Korea Overview Samsung Electronics is strategically deploying dedicated hybrid bonding lines in its domestic facilities for HBM4, aiming to secure market leadership. The company has successfully commenced mass producti... -
SK Hynix Initiates HBM Packaging Hub Construction in Cheongju to Bolster AI Memory Capacity
専門メディア South Korea Overview SK Hynix has broken ground on a substantial advanced packaging facility in Cheongju Technopolis, signaling a strategic shift in AI semiconductor competition from wafer fabrication to performance-critical... -
Hanmi Semiconductor Unveils Second-Gen Hybrid Bonder for Advanced HBM Stacking, Investing $67M in New Factory
専門メディア South Korea Overview Hanmi Semiconductor is set to introduce its second-generation hybrid bonder prototype this year, crucial for next-generation HBM mass production with over 20 stacked layers. Concurrently, the company is ... -
ABF Substrate Becomes Critical Bottleneck in AI Hardware Supply Chain, Driven by Ajinomoto’s Dominance
専門メディア (分析) Taiwan Overview Ajinomoto Build-up Film (ABF), an essential insulating dielectric for high-performance substrates, has emerged as an unexpected bottleneck in the AI hardware ecosystem due to Ajinomoto Fine-Techno's ne... -
TSMC Unveils SoIC 3D Stacking Roadmap: Achieving 4.5µm Pitch by 2029, Enabling Face-to-Face Chiplet Integration for Fujitsu Monaka CPU
専門メディア Taiwan Overview TSMC has revealed its SoIC (System on Integrated Chips) 3D stacking roadmap, targeting a 4.5-micron pitch by 2029, down from today's 6 microns. This advanced face-to-face (F2F) chiplet stacking technology, pa... -
TSMC Forges Exclusive CoPoS Supply Chain to Secure Next-Gen AI Packaging Dominance
専門メディア Taiwan Overview TSMC is reportedly implementing a highly exclusive supply chain strategy for CoPoS, its next-generation panel-level packaging technology, to solidify its leadership in AI semiconductors. This move, involving ...
