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Samsung Electro-Mechanics Unveils Next-Gen Package Substrate Technologies for AI & Servers at KPCA Show 2026, Highlighting Warp Reduction & High-Density Interconnects
Samsung Electro-Mechanics South Korea Overview Samsung Electro-Mechanics showcased a comprehensive suite of next-generation semiconductor package substrate technologies targeting the AI and server markets at 'KPCA Show 2026.' The company... -
AI Accelerator ABF Substrate Shortage to Exceed 40% by 2028; Ibiden, Unimicron, Samsung Electro-Mechanics Rush Billions in Capacity Expansion
Tom's Hardware Japan Overview The supply shortage of ABF (Ajinomoto Build-up Film) substrates for AI accelerators is projected to worsen significantly, potentially reaching approximately 10% by late 2026, 21% by 2027, and over 40% by 202... -
BESI Hybrid Bonding System Orders Exceed 150 Units, HBM5 Onward to Accelerate Memory Adoption
PhotonCap Unknown Overview BESI has secured over 150 cumulative orders for its hybrid bonding systems, with six integrated production lines (including 30 BESI bonders) implemented by major logic customers in partnership with Applied Mate... -
Samsung’s zHBM Concept Promises 70% Lower I/O Power, 2.3x Bandwidth vs. HBM5 via Hybrid Bonding for Edge AI
Tom's Hardware South Korea Overview Samsung proposes zHBM, an innovative memory architecture that directly stacks DRAM onto the processor, bypassing the interposer, and is projected to reduce I/O power by approximately 70% compared to HB... -
ASE’s SPIL Nears Arizona Back-End Test Facility Expansion Amidst $10.5B CAPEX Surge; Amkor Boosts US Packaging Investment to $12B
TrendForce Taiwan Overview ASE subsidiary SPIL is finalizing plans for a new back-end test facility in Arizona, part of ASE's $10.5 billion CAPEX for 2026, which includes $4 billion for new facilities and $6.5 billion for equipment. Conc... -
CSIS Report: AI and HBM Demand Drive New Semiconductor Shortage, Highlighting Structural Shift and Supply Chain Security Concerns
CSIS USA Overview A CSIS report indicates that the current memory shortage reflects both structural demand growth from AI and cyclical market fluctuations. The rapid expansion of AI data centers has led to a surge in demand for HBM (High... -
Google Reportedly Considering CoWoS as Backup for 2027 TPUs Amid Intel EMIB-T Substrate Yield Lag Reports
No source name USA Overview Google's Humufish TPU project, slated for mass production by late 2027, is reportedly considering TSMC's CoWoS as a backup packaging solution, following reports of lagging substrate yields for Intel's EMIB-T t... -
Nvidia Chip Sales Projected to Double Next Year, Accelerating HBM4 Transition Amid TSMC CoWoS Packaging Bottleneck
No source name USA Overview Nvidia CEO Jensen Huang forecasts a doubling of Nvidia chip sales next year and an accelerated transition to HBM4, with TSMC's CoWoS advanced packaging identified as a primary shipping bottleneck. CoWoS is cru... -
FCS Group Secures Exclusive Taiwan/Southeast Asia Distribution Rights for CKST Glass Substrate Equipment, Entering AI Advanced Packaging Market
BigGo Finance Taiwan Overview FCS Group, an injection molding machine manufacturer, has secured exclusive distribution rights for CKST (China Korea Smart Technology) glass substrate advanced packaging equipment in Taiwan and Southeast As... -
Samsung Electronics Reorganizes Cheonan Plant for HBM Packaging, Outsourcing Mobile AP Backend Processes to Boost AI Memory Capacity
TrendForce South Korea Overview Samsung Electronics is reportedly reorganizing its Cheonan plant's backend operations to prioritize High Bandwidth Memory (HBM) packaging due to surging AI demand. This strategic shift involves phasing out...
