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Tecman Unveils Anti-Thermal Propagation (ATP) Pads to Prevent Thermal Runaway in Battery Energy Storage Systems
Energy-Storage.news UK Overview Tecman has developed anti-thermal propagation (ATP) pads, including framed and encapsulated versions, as cell barriers to prevent thermal runaway propagation in battery energy storage systems (BESS). These... -
Parker Lord Develops CoolTherm SF-1000, a Low-Cost Liquid-Dispensed Solution to Mitigate Thermal Runaway Propagation in EV Cylindrical Battery Packs
E-Mobility Engineering USA Overview Parker Hannifin has introduced CoolTherm SF-1000, a liquid-dispensed silicone foam material designed to mitigate thermal runaway propagation in cylindrical lithium-ion cell battery packs. This non-expa... -
tesa Celebrates 90 Years of tesafilm® with Expansion into Sustainable Production and Introduction of tesafilm® PAPER
tesa Germany Overview tesa is celebrating the 90th anniversary of its flagship product, tesafilm®, highlighting its evolution, including the recent introduction of tesafilm® PAPER. The company is investing in plant expansion for more sus... -
Wacker Chemie Unveils ELASTOSIL® CM Series: Ceramifying Thermal Barriers for Enhanced EV Battery Safety During Thermal Runaway
Wacker Chemie AG Germany Overview Wacker Chemie AG will showcase its ELASTOSIL® CM series at The Battery Show Europe 2026, presenting innovative silicone technologies to significantly enhance EV battery safety. This series offers flexibl... -
Beckers Group Inaugurates New Renewable Resin Manufacturing Plant in India, Bolstering Sustainable Coatings Supply
Coatings World India Overview Beckers Group, through its JV Berger-Becker Coatings, opened a new renewable resin manufacturing plant in Nagpur, India, on May 28, 2026. This facility will produce renewable and recycled-content polyester r... -
SemiMedia Reports China Accelerating Global Catch-Up in Advanced Packaging Materials for AI and HPC
SemiMedia China Overview A SemiMedia report indicates that China is accelerating its global catch-up in advanced packaging materials, driven by the demand for AI chips and high-performance computing (HPC). The focus is on developing high... -
T-Global Technology Launches TG-AD30D, a Low-Outgassing Thermal Pad with 3.0 W/m·K Conductivity for High-Reliability Electronics
T-Global Technology Taiwan Overview T-Global Technology has introduced the TG-AD30D, an advanced low-outgassing thermal pad designed for high-reliability electronics and sensitive environments. This hybrid thermal pad offers 3.0 W/m·K th... -
PatSnap Eureka Report: Optimizing Adhesive Coverage to Reduce Cell Delamination Risks in Advanced Packaging and Flexible Displays
PatSnap Eureka Global Overview A PatSnap Eureka report highlights the critical need for improved adhesive technologies and optimized coverage to prevent cell delamination in advanced semiconductor packaging and flexible display sectors. ... -
QinanX New Material Offers Fast-Curing, High-Clarity, Low-Shrinkage UV-Curable Adhesives for Electronics, Optics, and Medical Industries
QinanX New Material China Overview QinanX New Material provides UV-curable adhesives that cure in seconds under UV light for a wide range of applications, including electronics, optical lenses, displays, medical devices, and glass/plasti... -
Arkema Unveils Next-Gen Material Solutions for EV Batteries at Battery Show Europe 2026, Enhancing Adhesion, Energy Density, and Recyclability
Arkema France Overview Arkema showcased integrated material solutions for EV and energy storage system battery packs at The Battery Show Europe 2026, focusing on improved adhesion, energy density, safety, and recyclability. Key innovatio...
