Adhesives & Sealants– category –
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BindEthics Launches Industrial-Scale Production of Bio-based, Formaldehyde-Free Ecohesive™ Adhesive
Packaging Europe UK Overview UK-based BindEthics has commenced industrial-scale production of its bio-based, formaldehyde-free adhesive, Ecohesive™, scaling up from 40-liter to 2,000-liter batches. This innovative adhesive aims to elimin... -
Henkel Forges Exclusive US Distribution Partnership with Applied Adhesives to Dominate Flexible Packaging Market
PR Newswire USA Overview Henkel Adhesive Technologies has announced an exclusive distribution partnership with Applied Adhesives to significantly expand its footprint in the US flexible packaging market. This collaboration leverages Henk... -
Adhesives & Sealants Weekly Report July 5, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report July 05, 2026 (PDF) — Download Weekly Report July 05, 2026 (PDF) — DownloadDownload 🎙 Podcast July 05, 2026 (... -
LOCTITE® Unveils Leak-Free Anaerobic Sealants for Hydrogen Systems: A Next-Gen Solution with Pressure, Temperature, and Vibration Resistance
Assembtek Germany Overview The LOCTITE® brand has launched anaerobic sealants as a next-generation solution for hydrogen system sealing. These sealants cure in the absence of air between metal surfaces, forming durable, leak-free thermos... -
Dow Unveils TC-3120 High-Performance Thermal Gel for Data Centers: High Thermal Conductivity and Excellent Flowability to Address AI and Big Data Challenges
Assembtek USA Overview Dow has launched TC-3120, a high-performance thermal gel specifically engineered for thermal management in data center chips, servers, and high-speed optical modules (400G/800G). This thermal gel features exception... -
TrendForce Reports Samsung Files New HBM Dummy Die Patent to Enhance 16-Layer HBM5 Stack Reliability
TrendForce Taiwan Overview TrendForce reports that Samsung has filed a new HBM dummy die patent aimed at enhancing 16-layer HBM5 stack reliability. This patent seeks to address warpage and heat dissipation issues in high-stack configurat... -
SK Hynix’s Advanced MR-MUF Packaging Process Reduces HBM4 Thermal Resistance by 17%, Contributing to AI Accelerator Chip Stabilization
Kynix China Overview SK Hynix's Advanced MR-MUF (Mass Reflow Molded Underfill) packaging process has been shown to reduce HBM4 thermal resistance by 17% compared to conventional HBM4. This innovative technology is crucial for maintaining... -
MDPI Publishes Research on Improving Lithium-Ion Battery Bottom Guard Plate Impact Protection Using Structural Adhesives
MDPI Switzerland Overview Research published in MDPI explores the use of structural adhesives to enhance the impact protection performance of lithium-ion power battery bottom guard plates. The study found that stronger adhesive bonds sig... -
Kynix Explains HBM4 Hybrid Copper Bonding Achieves Over 20% Thermal Performance Improvement, Enabling Stable Clock Speeds Under AI Loads
Kynix China Overview Kynix explains that Hybrid Copper Bonding (HCB) technology for HBM4 improves thermal performance by over 20%. This method eliminates solder bumps and underfill, directly connecting copper layers to significantly redu... -
Samsung Announces HBM4E Hybrid Copper Bonding Reduces Package Height by Over 15% While Improving Thermal Characteristics
Sammy Fans South Korea Overview Samsung has presented research on its HBM4E packaging strategy, emphasizing that Hybrid Copper Bonding (HCB), which eliminates underfill materials, offers superior thermal properties compared to convention...
