Adhesives & Sealants– category –
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Collaborative Research Unveils Recyclable Epoxy Adhesives for Wind Turbine Blades, Paving Way for Sustainable Wind Power
Renewable Energy Research Journal Global Overview Collaborative research on recyclable epoxy adhesives for bonding wind turbine blades has been announced. This study aims to significantly facilitate the dismantling and recycling of large... -
New Thermal Interface Materials Address High Heat Flux Challenges in AI Servers, Ensuring Data Center Stability
Data Center Dynamics Global Overview New Thermal Interface Materials (TIMs) have been announced to address the high heat flux challenges stemming from the rapid advancement of AI servers. These TIMs maximize heat transfer efficiency betw... -
Low Warpage Mold Compound Solutions Highlighted at IEEE ECTC 2026 Address 2.5D/3D Packaging Challenges
Advanced Packaging World (ECTC 2026 Post-Conference Review) Global Overview At the IEEE ECTC (Electronic Components and Technology Conference) 2026 post-conference review, multiple low warpage molding compound solutions addressing warpag... -
Advancements in Electrically Insulating Adhesives for EV Battery Modules Strengthen Safety and Thermal Runaway Protection
Batteries & Energy Storage Technology Global Overview Breakthrough advancements in electrically insulating adhesives for EV battery modules have been reported. This new material achieves both high dielectric strength and excellent adhesi... -
Review Paper on Adhesives for Solid-State Batteries Published, Accelerating Next-Gen Battery Development
Journal of Electrochemical Energy Conversion and Storage Global Overview A review paper has been published summarizing recent research progress on adhesive technologies crucial for high-performance solid-state batteries. This paper metic... -
New Underfill Material Enables High-Performance Chiplet Integration in Fan-Out Wafer-Level Packaging
Semiconductor Packaging News Global Overview A new underfill material designed for Fan-Out Wafer-Level Packaging (FOWLP) has been developed, enabling next-generation high-performance chiplet integration. This material combines excellent ... -
Heraeus Announces New Pressureless Sintering Paste for High-Power GaN Devices, Balancing Cost and Performance
Semiconductor Today Germany Overview Heraeus has announced an innovative pressureless sintering paste specifically for high-power GaN (gallium nitride) devices. This material achieves high bonding strength and excellent thermal conductiv... -
Research Team Unveils Potential of Bio-Based Adhesives for Sustainable Electronics Manufacturing
ACS Sustainable Chemistry & Engineering Global Overview A research team has published groundbreaking findings on bio-based adhesives aimed at environmentally friendly electronics manufacturing. This study demonstrates the potential for a... -
Sumitomo Bakelite Unveils Advanced Encapsulation Materials for Automotive Power Semiconductors, Boosting EV/HEV Safety and Efficiency
Automotive Electronics World Japan Overview Sumitomo Bakelite has announced new advanced encapsulation materials designed to enhance the reliability of automotive power semiconductors for Electric Vehicles (EVs) and Hybrid Electric Vehic... -
Momentive Performance Materials Expands High Thermal Conductivity Potting Compound Capacity to Meet Surging EV and Power Electronics Demand
Chemical Week USA Overview Momentive Performance Materials announced a significant expansion in its production capacity for high thermal conductivity potting compounds to address surging demand from EV battery packs and power electronics...
