New Technology– category –
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Thermally Activated “D-glue” Streamlines High-Value Plastic Recovery from End-of-Life Electronics
Cyclomer UK Overview A new thermally activated adhesive, "D-glue," significantly enhances the recovery of high-value technical plastics from end-of-life electronics. This innovative adhesive loses its bonding properties at elevated tempe... -
Master Bond Offers Advanced Adhesives, Sealants & Coatings for R&D, Meeting NASA Low Outgassing & USP Class VI Standards
Master Bond USA Overview Master Bond is providing a wide range of advanced adhesive, sealant, and coating formulations for Research & Development (R&D) applications, meeting rigorous certifications such as NASA low outgassing, US... -
NFION Unveils NF150-788 Silicone Foam with Ultra-Low Thermal Conductivity for EV Battery Cell Insulation
NFION China Overview NFION has introduced NF150-788, a silicone foam designed for thermal, cushioning, and electrical insulation between EV battery cells. This material boasts an ultra-low thermal conductivity of ≤0.12 W/(m·K), excellent... -
Krayden Offers Low-Stress Green Epoxy Molding Compound LINQSOL EMC-7535 for High-Voltage, High-Power Semiconductors
Krayden USA Overview Krayden is offering LINQSOL EMC-7535, a green epoxy molding compound (EMC) engineered for high-voltage and high-power semiconductor devices. This material features low modulus for reduced stress, a high glass transit... -
Saint-Gobain Tape Solutions Develops Adhesives, Composites, and Thermal Gap Fillers for EV Batteries
Saint-Gobain Tape Solutions USA Overview Saint-Gobain Tape Solutions is offering a comprehensive range of material solutions for Electric Vehicle (EV) batteries, including adhesive tapes, composites, foams, and thermal gap fillers. A com... -
TSMC’s CoWoS Drives AI Semiconductor Demand, Japanese Material Suppliers Expand Ecosystem in Taiwan
The Economy Taiwan Overview TSMC's CoWoS advanced packaging technology is a primary driver for demand in AI accelerators and HBM, leading Japanese material suppliers like Namics (underfill) and Fujifilm (CMP slurry) to expand operations ... -
3M Supplies 5590H Thermally Conductive Acrylic Interface Pad for IC Chips and EV Batteries
Facebook (3M) USA Overview 3M is supplying its 5590H Thermally Conductive Acrylic Interface Pad, designed to provide an efficient heat transfer path between high-heat-generating components like IC chips and EV batteries, and their respec... -
WEVO-CHEMIE Develops High-Insulation, Thermally Conductive Polyurethane Potting System for EV Battery BMS
WEVO-CHEMIE GmbH Germany Overview WEVO-CHEMIE GmbH has developed WEVOPUR 60210 FL T, a polyurethane potting system for multilayer PCBs in EV battery management systems (BMS), offering 0.8 W/m·K thermal conductivity and dielectric strengt... -
Wevo Unveils WEVOSIL 26040 FL, a 4 W/m·K Silicone Gap Filler for High-Performance Thermal Management
Wevo Germany Overview Wevo has launched WEVOSIL 26040 FL, a new silicone gap filler thermal interface material (TIM) boasting a thermal conductivity of 4 W/m·K. Optimized for power electronics and battery technologies, this material feat... -
Moldex3D Compression Molding Simulation Achieves Semiconductor Package Defect Prediction and Quality Enhancement
Rheologist gaze & solutions (Moldex3D) Taiwan Overview Moldex3D provides CAE simulation tools for compression molding processes in advanced semiconductor packaging, enabling precise simulation of how encapsulating materials like epoxy mo...
