Photonics– category –
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Bernstein Report Maps AI Data Center Connectivity Evolution: From Pluggable to CPO by 2028
Futunn News Hong Kong Overview A Bernstein report outlines the likely progression for AI data center connectivity: from traditional pluggable modules to LPO/NPO, then CPO, and eventually optical I/O/optical fabric. Near-Packaged Optics (... -
LPO, NPO, CPO: Navigating the Evolving Landscape of Optical Interconnects for AI Data Centers
Optcore International Overview This article compares Linear-drive Pluggable Optics (LPO), Near-Packaged Optics (NPO), and Co-Packaged Optics (CPO) as critical evolving interconnect technologies for AI data centers. LPO significantly redu... -
AI Data Center Optical Interconnect Market Surges with CPO, Silicon Photonics, and NTT’s IOWN Initiative
openPR.com USA Overview The market for optical interconnects in AI data centers is surging due to the essential need for ultra-high-speed optical links in GPU-dense AI clusters, where bandwidth directly impacts model training efficiency.... -
Optical Interconnect Market to Soar by 2035 Driven by 1.6T Transceivers and AI Data Centers
SNS Insider India Overview The optical interconnect market is experiencing robust growth, propelled by the adoption of 800G and emerging 1.6T coherent optical transceiver technologies in metro and long-haul data center interconnect appli... -
OFC 2026 Spotlights 1.6T Commercialization and CPO Debate Driving AI Optical Networks
FS.com International Overview OFC 2026 underscored AI's accelerating influence on optical network infrastructure, with a key focus on 1.6T commercial deployment and the ongoing CPO vs. pluggable transceiver debate. Coherent demonstrated ... -
Lightmatter Secures $850M, Pioneering Photonic Interconnects and CPO for AI Infrastructure
Tracxn USA Overview Lightmatter, a leader in photonic interconnects and co-packaged optics (CPO), has raised $850 million to address data center bottlenecks between XPUs and switches in AI infrastructure. Their technology supports lane s... -
Fabric.AI to Demo MicroLED Interconnect for AI Clusters by Late 2026, Promising Major Efficiency Gains
Converge Digest USA Overview Fabric.AI plans to demonstrate its Neural I/o MicroLED-based optical interconnect platform by late 2026, targeting critical data movement challenges within AI clusters. Developed in partnership with Kopin Cor... -
MIT Breakthrough: New Optical Phased Array Design Shrinks LiDAR Sensors with Minimized Crosstalk
Photonics Spectra USA Overview MIT researchers have developed a novel silicon-photonics chip design for integrated optical phased arrays (OPAs) that drastically minimizes unwanted crosstalk, paving the way for significantly more compact,... -
Near-Packaged Optics (NPO) Emerges as Mid-Term Solution for AI Data Centers, Bridging Pluggable and CPO
Optcore International Overview Near-Packaged Optics (NPO) is an optical interconnect architecture that positions optical modules closer to the switch ASIC on the PCB, reducing electrical signal distances and enhancing signal integrity co... -
NVIDIA’s Rubin Ultra Architecture Propels Co-Packaged Optics into Production for Gigawatt-Scale AI
Radiant Blog USA Overview NVIDIA's Vera Rubin Ultra architecture, unveiled at GTC 2026, marks the pivotal shift of Co-Packaged Optics (CPO) from conceptualization to an essential production technology for gigawatt-scale AI deployments. C...
