Semiconductor Back-End– category –
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CHIPS Act Successfully Attracts Taiwanese Semiconductor Suppliers to US, Creating New Opportunities in Advanced Packaging and Materials Supply
Fidelity Investments USA Overview The U.S. CHIPS Act's $39 billion manufacturing incentives are successfully drawing Taiwan-based semiconductor manufacturers to the United States, providing concrete economic reasons for establishing new ... -
CXMT Confronts HBM Production Barriers: China’s Memory Ambitions Hinge on Yield and Advanced Packaging Breakthroughs by 2028
South China Morning Post China Overview Chinese DRAM manufacturer CXMT continues to grapple with significant technical challenges in establishing stable commercial production of High Bandwidth Memory (HBM), according to SemiAnalysis. Whi... -
Fraunhofer Develops DUV-Assisted Athermal Laser Grooving for Low-κ Dielectrics in Advanced Packaging
Karriere Fraunhofer-Gesellschaft Germany Overview Fraunhofer ILT is exploring a novel dual-pulse approach, DUV-assisted athermal laser grooving, for low-κ dielectrics in advanced microelectronics packaging. This technology temporarily ge... -
EU Chips Act Funds €210 Million for 3D IC Advanced Packaging, Benefiting Infineon, ASML Subsidiary, and Soitec
Qishuai-cn Germany Overview The European Commission announced its first EU Chips Act-funded project, allocating a total of €210 million to Germany's Infineon, an ASML subsidiary in the Netherlands, and France's Soitec. This funding is de... -
Samsung Pivots to HBM4, Hits $1B Sales Milestone, Eyes Optical HBM by 2028
Samsung South Korea Overview Samsung Electronics has aggressively pivoted half of its High Bandwidth Memory (HBM) production capacity to HBM4, achieving over $1 billion in sales within four months and projecting $10 billion annually by y... -
Applied Materials Unleashes Six New Systems to Turbocharge AI Chips with Advanced Packaging and Sub-10nm Defect Detection
Applied Materials USA Overview Applied Materials has launched six innovative systems to significantly accelerate the development and manufacturing of DRAM and advanced packaging for next-generation AI chips. These solutions tackle critic... -
TSMC’s CoWoS Packaging Equipment Supply Chain Sees Robust Demand Amid AI Surge
DigiTimes Taiwan Overview TSMC's CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging equipment supply chain is experiencing extremely strong demand, driven by the explosive growth of AI chips. Key equipment manufacturers are ramping up... -
Kioxia Accelerates Next-Gen Memory Mass Production Amid AI Boom, Poised for Dramatic Comeback
Channel News Asia Japan Overview Japanese memory semiconductor giant Kioxia is accelerating preparations for mass production of next-generation memory products, driven by the explosive demand for AI technology. The company aims to streng... -
Nomura Raises TSMC Target Price, Citing AI Infrastructure Cycle as Key Growth Driver
Futu News Taiwan Overview Nomura has upgraded TSMC's target price, attributing its strong growth to the accelerating AI infrastructure cycle. The surging demand for AI chips has led to TSMC's advanced packaging technologies, particularly... -
JCET Shares Soar on Major Investment in Advanced Chip Packaging Capabilities
Morningstar (Dow Jones News) China Overview Shares of China-based OSAT leader JCET Group surged following the announcement of a significant new investment in its advanced chip packaging capabilities. This investment aims to substantially...
