Semiconductor Back-End– category –
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Advanced Packaging Becomes the New Bottleneck for AI Chip Production, Driving Global Capex Race and Nvidia’s Supply Diversification Efforts
The Economy International Overview Advanced packaging, not process technology, is now the primary bottleneck in AI chip production, prompting Nvidia to explore diversifying its CoWoS supply, potentially including Intel's EMIB. This shift... -
Semiconductor Back-End Weekly Report July 12, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report July 12, 2026 (PDF) — Download Weekly Report July 12, 2026 (PDF) — DownloadDownload 🎙 Podcast July 12, 2026 (... -
SK Hynix to Heavily Invest in ASML EUV for HBM Production in Yongin and Cheongju, Expanding Indiana Packaging Facility
Seeking Alpha South Korea Overview SK hynix plans to extensively deploy ASML's EUV (Extreme Ultraviolet) lithography equipment at its Yongin Semiconductor Cluster and Cheongju advanced packaging facilities, significantly bolstering High-... -
Semiconductor Industry Pivots to Heterogeneous Large-Scale Integration (HLSI) as AI Reshapes Chip Design
Next Move Strategy Consulting (via EE Times) USA Overview Driven by surging AI workloads, the semiconductor industry is dramatically shifting beyond traditional System-on-Chip (SoC) paradigms towards Heterogeneous Large-Scale Integration... -
Micron’s HBM Order Book Fully Committed Through 2028, Secures Silicon Wafer Supply with 10-Year GlobalWafers Offtake Agreement
Investing.com USA Overview Micron Technology's High-Bandwidth Memory (HBM) order book is fully committed through 2026 and 2027, with customer bookings extending into 2028, clearly indicating that supply, not demand, is the binding constr... -
China’s Memory Industry Accelerates HBM3/3E Development; YMTC Leads in Wafer-to-Wafer Hybrid Bonding Patents
BloomingBit.io China Overview China's memory industry is rapidly advancing, with companies like CXMT focusing on HBM3 and HBM3E development, thereby narrowing the technology gap with South Korea. Notably, Yangtze Memory Technologies Co. ... -
Morgan Stanley Forecasts 93% Surge in CoWoS Demand by 2027, Anticipates AMD Venice CPU Adoption
Phemex News USA Overview Morgan Stanley projects a staggering 93% surge in global demand for CoWoS (Chip-on-Wafer-on-Substrate) technology by 2027, reaching 2.694 million units. Nvidia is expected to remain the largest consumer, accounti... -
Intel’s EMIB-T Emerges as CoWoS Alternative, New XBM Memory Architecture to Alleviate AI Memory Bottleneck
Tom's Hardware USA Overview Intel's 2.5D packaging technology, EMIB-T, is emerging as a credible alternative to TSMC's CoWoS for large-package AI accelerators, expanding validation for 36/35 µm bump pitch to 4.5x reticle silicon packages... -
Samsung and SK hynix Reportedly Reconsidering Hybrid Bonding Timeline for HBM, 16-High HBM4E May Be Earliest Adoption
TrendForce Taiwan Overview Samsung Electronics and SK hynix are reportedly reassessing the timeline for the widespread adoption of hybrid bonding technology in High-Bandwidth Memory (HBM). While initial expectations pointed to HBM4, both... -
Korea Institute of Industrial Technology Develops Novel Chip Integration Process Achieving 4x Commercial HBM Density
EurekAlert! South Korea Overview Researchers at the Korea Institute of Industrial Technology (KITECH) have developed an innovative chip integration process that achieves approximately four times the integration density of commercial High...
