Semiconductor Back-End– category –
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Micron Invests $9.3 Billion in Hiroshima for HBM Production Launching 2028, Expands Packaging Capacity in Singapore
TechsCurrent Japan Overview Micron Technology has broken ground on a $9.3 billion expansion of its Hiroshima, Japan factory to bolster High-Bandwidth Memory (HBM) production, with shipments expected around summer 2028, supported by Japan... -
AT&S Transforms Austrian Fehring Plant into Innovation Hub with €10M Investment, Bolstering Advanced PCB & Thermal Solutions
AT&S (Press Release) Austria Overview AT&S, a global leader in high-end PCBs and IC substrates, is investing approximately €10 million in its Fehring plant in Austria. This strategic upgrade aims to establish the facility as an innov... -
AI Memory Shortage Sparks Advanced Packaging Crisis: Ultrafast Lasers and Glass Substrates Emerge as New Bottlenecks
Chanelink China Overview A 'capacity crisis' in advanced packaging processes, triggered by the AI memory shortage, is causing ultrafast laser suppliers to become a new bottleneck in the supply chain. AI accelerators demand highly advance... -
HBM and ABF Shortages Intensify AI Chip Supply Bottlenecks, Ajinomoto Forecasts Over 20% ABF Supply Gap by 2027
Semiconductor Engineering USA Overview The primary bottlenecks for AI chip production are the critical shortage of High-Bandwidth Memory (HBM) and the complex packaging capacity required for GPUs/XPUs by Nvidia, AMD, and Google, coupled ... -
TSMC Significantly Expands CoWoS Advanced Packaging Capacity, to Begin Production of 14-Reticle-Size Packages by 2028 for Surging AI Demand
Biya Global Limited Taiwan Overview TSMC is substantially expanding its CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging capacity to meet the surging demand for AI chips. The company aims to nearly quadruple CoWoS capacity to 130,00... -
AT&S Initiates High-Volume AI Substrate Production in Malaysia, Backed by Major Customer Commitments and Projecting Substantial Revenue Growth
boerse-social.com Austria Overview AT&S, a leading Austrian manufacturer of high-end IC substrates, has commenced high-volume production of advanced AI substrates at its new Kulim, Malaysia, facility. This expansion, supported by lon... -
South Korean Conglomerates Samsung and SK Group Invest $252.5 Billion in Chungcheong Province, Bolstering HBM Packaging and AI Semiconductor Supply Chain
The Korea Herald South Korea Overview South Korean giants including Samsung Electronics, SK hynix, and Celltrion announced a combined 392 trillion won (approximately $252.5 billion) investment in Chungcheong Province across semiconductor... -
Amkor Technology Commits $2.5B-$3.0B to Advanced Packaging Facilities for AI Demand, Arizona Plant Slated for 2028 Production
Hudson Labs USA Overview Amkor Technology plans a substantial capital expenditure of $2.5 billion to $3.0 billion for fiscal year 2026, driven by accelerating demand for advanced packaging in AI and data center computing. The investment ... -
Nvidia Kicks Off Volume Production of Blackwell AI Accelerators with TSMC’s CoWoS-L, Supply to Remain Tight Through Q4
MetalSemi Asia Taiwan Overview Nvidia has commenced volume production of its next-generation Blackwell AI accelerators at TSMC, leveraging the 4NP process and advanced CoWoS-L packaging. Cloud service provider demand is projected to outs... -
Lam Research Drives AI Performance with Advanced Packaging, Tackling Bottlenecks and Boosting Power Efficiency through Chiplets and Panel-Based Manufacturing
Lam Research USA Overview Lam Research highlights advanced packaging as the critical innovation frontier for AI, addressing the limitations of traditional semiconductor scaling. By enabling chiplets to function as a single system, this a...
