Semiconductor Back-End– category –
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TSMC Plans Three Advanced Packaging Plants at Chiayi Science Park, Targeting Mass Production by 2027 for AI and Quantum Tech
Taiwan News Taiwan Overview TSMC plans three advanced packaging plants at Taiwan's Chiayi Science Park, with two slated for mass production by 2027. These facilities will focus on AI, heterogeneous integration, and quantum technology, le... -
Applied Materials’ Material Engineering Innovations, Led by Hybrid Bonding, Key to Scaling AI Chip Performance in the AI Era
Applied Materials (Official Blog/Article) USA Overview Applied Materials emphasizes that material engineering innovations, including its Kinex hybrid bonding system, are critical for scaling AI chip performance. The company is advancing ... -
Morgan Stanley Forecasts 93% CoWoS Demand Surge by 2027, Driven by AMD’s Venice CPU Shipments
KuCoin International Overview Morgan Stanley forecasts global CoWoS (Chip-on-Wafer-on-Substrate) demand to nearly double to 2.694 million wafers in 2027, a 93% increase from 1.394 million in 2026. This growth is predominantly driven by A... -
Wah Lee and Asahi Kasei Double Photoresist Capacity in Tainan to Capitalize on AI Advanced Packaging Boom and ABF Substrate Demand
BigGo Finance International Overview Wah Lee and Asahi Kasei are doubling high-resolution dry film photoresist capacity in Tainan to meet surging ABF substrate demand driven by AI, HPC, and advanced packaging. With the ABF substrate shor... -
ABF Substrates Emerge as the True Bottleneck in the AI Era, More Critical Than DRAM for High-Performance Computing
Industry Analysis International Overview ABF (Ajinomoto Build-up Film) substrates, not DRAM, are becoming the more critical bottleneck in the AI supply chain. Leading manufacturers like Ibiden and Unimicron are poised to benefit directly... -
Samsung Develops ‘2.xD’ Advanced Packaging Integrating HBM, Logic, and SiPh to Tackle AI Data Center Power and Data Bottlenecks
DigiTimes Taiwan Overview Samsung Electronics is developing '2.xD' advanced packaging technology that integrates HBM, logic chips, and silicon photonics (SiPh) into a single package. This innovation aims to resolve critical power consump... -
Amkor Technology Expands Arizona Campus with 67-Acre Acquisition, Bolstering U.S. Advanced Packaging OSAT Capacity
AllMind AI News USA Overview Amkor Technology has acquired an additional 67 acres in Arizona to significantly expand its U.S. advanced semiconductor packaging and test capacity. This expansion, supported by up to $407 million in CHIPS Ac... -
Global ABF Substrate Shortage to Persist Through 2028 Due to Soaring AI Demand, Impacting High-End Chip Production
DigiTimes Taiwan Overview The global market for ABF (Ajinomoto Build-up Film) substrates is projected to remain in shortage through 2028, driven by escalating demand for AI hardware. This scarcity directly impacts the production of high-... -
Applied Materials Unveils Seven New Systems for AI Chip DRAM Performance and Advanced 3D Packaging, Accelerating Bottleneck Resolution
Industry News International Overview Applied Materials introduced seven new semiconductor manufacturing systems designed to address bottlenecks in AI chip production, specifically enhancing DRAM performance scaling and advanced 3D packag... -
ASE Initiates Largest-Ever Global Expansion to Double CoWoS Capacity to 45,000 Wafers/Month by Late 2027
Industry Blog/Analysis International Overview ASE is undertaking its largest global factory expansion in history, commencing construction of six new packaging and testing plants in 2026. This aggressive ramp aims to increase monthly CoWo...
