Adhesive– tag –
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Olin and Huntsman Merge in $12.5 Billion All-Stock Deal, Forming North American Chemical Giant
Plastics Today USA Overview Olin Corp. and Huntsman Corp. announced an all-stock merger on June 16, 2026, creating OlinHuntsman Corp., a North American chemical powerhouse with approximately $12.5 billion in annual revenue. This strategi... -
Wisconsin Department of Transportation Releases Approved Products List to Ensure Material Quality for Construction Projects
Wisconsin Department of Transportation USA Overview The Wisconsin Department of Transportation has released an Approved Products List for pre-certifying materials, including adhesives and sealants, to guarantee their quality and performa... -
Zhengzhou Kerton Chemical Highlights Broad Applications of Epoxy Adhesives for High Performance and Reliability Across Industries
Zhengzhou Kerton Chemical Co., Ltd China Overview Zhengzhou Kerton Chemical Co., Ltd. emphasized the critical role of epoxy adhesives across diverse sectors including automotive, aerospace, electronics, construction, and new energy. For ... -
Hoenle Adhesives Launches High-Reliability Underfill ‘Structalit® 8205’ for Miniaturized, High-Density Electronic Assemblies
Adhesives & Sealants Industry (ASI) Germany Overview Hoenle Adhesives has introduced Structalit® 8205, an underfill designed for modern, miniaturized, and high-density electronic assemblies, offering exceptional mechanical stability, the... -
Penn State University Awards GAP Funding for Biodegradable UV-Curable Pressure-Sensitive Adhesive Development – Aiming for Environmental Impact Reduction
Penn State University USA Overview Penn State University has awarded GAP funding to 12 research commercialization projects, including the development of a "polypeptide-based biodegradable UV-curable pressure-sensitive adhesive." This nov... -
Henkel Offers Liquid Compression Molding (LCM) Solutions for Wafer-Level and Panel-Level Packaging
Henkel Adhesives Germany Overview Henkel provides encapsulation materials that enable advanced semiconductor packaging technologies where ICs are molded directly on wafers or panels prior to subsequent processing, using Liquid Compressio... -
Henkel Delivers Advanced Semiconductor Packaging Materials to Tackle Thermal and Mechanical Challenges in 2.5D/3D Packaging
Henkel Adhesives Germany Overview Henkel offers a diverse portfolio of advanced semiconductor packaging solutions, including lid and stiffener adhesives, EMI shielding, liquid compression molding solutions, and underfills. These material... -
JBC Technologies, a 3M™ Preferred Converter, Innovates Custom Dielectric Barriers for EV Battery and BESS Applications
JBC Technologies USA Overview JBC Technologies, as a preferred 3M™ converter, leverages extensive experience in processing flexible materials like pressure-sensitive adhesive tapes and reclosable fasteners into thin, high-strength adhesi... -
On-Chip Photonics Manufacturing Bottleneck: Key Lies in Improving Adhesive and Encapsulant Thermal and Mechanical Stress Resistance
Semiconductor Engineering USA Overview On-chip photonics, while promising faster, lower-power data transmission, faces significant manufacturing infrastructure challenges. Specifically, the material stack—including carrier wafers, tempor... -
Henkel Establishes North American Battery Application Center to Accelerate EV Battery Technology Development
Henkel Adhesives Germany Overview Henkel has launched a dedicated Battery Application Center in North America to provide an agile development approach, enabling the long-term success of the electric vehicle (EV) market. The center offers...
