Bonder– tag –
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BESI Hybrid Bonding System Orders Exceed 150 Units, HBM5 Onward to Accelerate Memory Adoption
PhotonCap Unknown Overview BESI has secured over 150 cumulative orders for its hybrid bonding systems, with six integrated production lines (including 30 BESI bonders) implemented by major logic customers in partnership with Applied Mate... -
HANMI Semiconductor Invests $91.4 Million in Largest-Ever 8th Production Facility in Incheon to Meet Soaring AI Chip Demand
Business Wire South Korea Overview HANMI Semiconductor is investing $91.4 million (approximately 130 billion KRW) to establish its largest-ever 8th production facility in Incheon, by acquiring Mercury Co., Ltd.'s factory, to proactively ... -
Hanmi Semiconductor Invests $92 Million in Largest-Ever 8th Plant for AI/HBM Demand, Enters U.S. Market
Pulse 2.0 South Korea Overview South Korean Hanmi Semiconductor is investing approximately 130 billion won (about $92 million) to construct its largest-ever 8th production facility, a direct response to the explosive demand for AI and Hi... -
Hanmi Semiconductor Leads HBM4 TC Bonder Market, Diversifies Client Base with Micron Deals to Reduce SK Hynix Dependency
digitimes Taiwan Overview Hanmi Semiconductor has gained a significant lead over competitor Hanwha Semitech in the crucial thermal compression (TC) bonder market for High Bandwidth Memory (HBM) manufacturing. This market advantage is dri... -
Samsung Delays Hybrid Bonding HBM Mass Production to 2029-2030, Aligning with Technical Challenges and NVIDIA’s Next-Gen GPUs
TrendForce South Korea Overview Samsung Electronics is reportedly delaying the full-scale mass production of its hybrid bonding technology for next-generation HBM and logic semiconductors until 2029-2030. The company is currently buildin... -
Hanmi Semiconductor Secures ₩44.2 Billion SK hynix Order for HBM4 TC Bonders, Signaling Robust Advanced Packaging Equipment Market Growth
HTX South Korea Overview Hanmi Semiconductor has received a significant ₩44.2 billion (approx. $32 million) order from SK hynix for its TC Bonder 4.5 Griffin, crucial for next-generation HBM4 production, with delivery slated for early Se... -
SK Hynix Boosts HBM4 Production with Major TC Bonder Order from Hanmi Semiconductor
The Korea Herald South Korea Overview SK Hynix has made a significant investment, ordering ₩44.2 billion (approx. $28.7 million USD) worth of advanced 'TC Bonder 4.5 Griffin' thermo-compression bonders from Hanmi Semiconductor. This stra... -
Hanmi Semiconductor Forecasts HBM4 TC Bonder Rebound in Q2, Announces US Expansion Plans
BigGo Finance South Korea Overview Hanmi Semiconductor anticipates a significant rebound in HBM4 TC bonder orders from Q2 2026, driven by accelerating AI semiconductor demand, despite a Q1 slump during the HBM3E-to-HBM4 transition. The c... -
Hanmi Semiconductor Unveils Second-Gen Hybrid Bonder for Advanced HBM Stacking, Investing $67M in New Factory
専門メディア South Korea Overview Hanmi Semiconductor is set to introduce its second-generation hybrid bonder prototype this year, crucial for next-generation HBM mass production with over 20 stacked layers. Concurrently, the company is ...
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