Build-up Film– tag –
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Semiconductor Back-End
ABF Substrates Emerge as the True Bottleneck in the AI Era, More Critical Than DRAM for High-Performance Computing
Industry Analysis International Overview ABF (Ajinomoto Build-up Film) substrates, not DRAM, are becoming the more critical bottleneck in the AI supply chain. Leading manufacturers like Ibiden and Unimicron are poised to benefit directly... -
Semiconductor Back-End
Global ABF Substrate Shortage to Persist Through 2028 Due to Soaring AI Demand, Impacting High-End Chip Production
DigiTimes Taiwan Overview The global market for ABF (Ajinomoto Build-up Film) substrates is projected to remain in shortage through 2028, driven by escalating demand for AI hardware. This scarcity directly impacts the production of high-... -
Semiconductor Back-End
HBM and ABF Shortages Intensify AI Chip Supply Bottlenecks, Ajinomoto Forecasts Over 20% ABF Supply Gap by 2027
Semiconductor Engineering USA Overview The primary bottlenecks for AI chip production are the critical shortage of High-Bandwidth Memory (HBM) and the complex packaging capacity required for GPUs/XPUs by Nvidia, AMD, and Google, coupled ... -
Semiconductor Back-End
Ibiden and Unimicron Unveil Over $5 Billion Investment to Dramatically Expand AI Server ABF Substrate Production
Next Financial Japan Overview Japanese Ibiden and Taiwanese Unimicron are jointly investing over ¥800 billion (approximately $5 billion USD) to significantly increase production capacity for high-performance ABF (Ajinomoto Build-up Film)... -
Semiconductor Back-End
ABF Substrate Becomes Critical Bottleneck in AI Hardware Supply Chain, Driven by Ajinomoto’s Dominance
専門メディア (分析) Taiwan Overview Ajinomoto Build-up Film (ABF), an essential insulating dielectric for high-performance substrates, has emerged as an unexpected bottleneck in the AI hardware ecosystem due to Ajinomoto Fine-Techno's ne...
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