Co-packaged Optics– tag –
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Lintes Accelerates Optical Communication R&D and Manufacturing for AI Connectivity Expansion, Supporting Next-Gen AI Infrastructure
PR Newswire (Lintes) Taiwan Overview Lintes announced it is accelerating optical communication R&D and scalable manufacturing capabilities to support the expansion of AI connectivity. The company is focused on providing ultra-high-sp... -
GF Securities Highlights AI Infrastructure Bottlenecks Shifting from GPUs to Optical Interconnects, Including CPO
Futunn News (GF Securities Report) China Overview GF Securities has released an analysis report indicating that performance bottlenecks in AI infrastructure are gradually shifting from conventional GPU computing capabilities to optical i... -
Marvell Highlights Importance of Plasmonics for Higher Bandwidth Optics in the AI Era
Marvell Blog USA Overview Marvell, in its official blog, discussed the critical role of plasmonics technology as a key enabler for high-bandwidth optical communication in the AI era. Plasmonics facilitates higher integration, ultrafast m... -
Keysight Expands Photonic Design Automation Portfolio with System-Level Simulation to Accelerate Optical Communications Development
Keysight Newsroom USA Overview Keysight Technologies has announced an expansion of its Photonic Design Automation (PDA) portfolio, adding new system-level simulation capabilities. This enhancement allows optical communication system desi... -
TechInsights Identifies Silicon Photonics as Backbone for HPC and AI Data Centers, Highlighting New Industry Opportunities
TechInsights Blog Canada Overview TechInsights' analysis highlights silicon photonics as an indispensable backbone rapidly emerging for High-Performance Computing (HPC) and AI data centers. This technology overcomes the limitations of tr... -
PhotonCap Explains Characteristics and Data Center Impact of DSP, LPO, NPO, CPO Optical Interconnect Technologies for the AI Era
PhotonCap USA Overview PhotonCap has published an article analyzing DSP, LPO, NPO, and CPO as key optical interconnect technologies driving AI data center evolution. The piece thoroughly compares their advantages and challenges in terms ... -
Credo Semiconductor Details Near-Package Optics (NPO) Adoption Trends, Addressing Power and Performance Challenges in AI Data Centers
Credo Semiconductor Blog USA Overview Credo Semiconductor has published a blog detailing the adoption trends and critical importance of Near-Package Optics (NPO) for enhancing power efficiency and performance in AI/ML data centers. NPO s... -
Tower Semiconductor and Marvell Exceed 5 Million Coherent PIC Shipments for AI Data Centers, Driving High-Performance Connectivity
PIC Magazine USA Overview Tower Semiconductor and Marvell have announced shipping over 5 million coherent Photonic Integrated Circuits (PICs) for AI data centers. This milestone underscores their success in delivering high-speed, low-pow... -
TSMC’s COUPE Platform for Co-Packaged Optics Targets 2026 Mass Production, Integrating Micro LEDs for AI Cluster Performance Boost
The Storm Media Taiwan Overview TSMC has announced the 2026 mass production launch of "COUPE" (Compact Universal Photonic Engine), an innovative platform for co-packaged optics (CPO) interconnects. Utilizing SoIC bonding to stack photoni... -
Glass Substrates: The Next Frontier in AI Packaging and the Race to Mass Production
The Economy South Korea Overview Glass substrates are rapidly emerging as a transformative technology in advanced AI chip packaging, poised to replace conventional organic substrates and silicon interposers by offering superior dimension...
