Copper– tag –
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Advanced Die Attach Solder Paste for High-Power Packaging: Achieving >60-70 W/m·K Thermal Conductivity and Precision Filling
Global SMT & Packaging Global Overview A Global SMT & Packaging article emphasizes the critical role of die attach solder paste in high-power packaging, achieving excellent thermal conductivity of 60-70 W/m·K (and >70 W/m·K with C... -
Indium Corporation to Unveil High-Reliability Power Device Packaging Solutions, Including SiC and Cu Sintering Pastes, at PCIM Asia 2026
Indium Corporation USA Overview Indium Corporation will showcase its next-generation high-reliability packaging solutions for power electronics at PCIM Asia 2026. Key offerings include InFORCE®MF pressure silver sintering paste for SiC d... -
Epsilon Unveils Advanced Semiconductor Packaging Materials at ASPS 2026 for AI Data Centers: Die Attach Copper Paste Improves Thermal Dissipation and Reduces Cost
The Elec Inc. South Korea Overview Epsilon showcased advanced packaging material solutions at the 2026 Advanced Semiconductor Packaging & Chiplet Show (ASPS 2026), targeting advancements in AI data centers. Exhibited materials includ... -
2026 ECTC Highlights: Applied Materials and Partners Pioneer Hybrid Bonding with Fine-Pitch Copper and Ultra-Low Temperature Annealing
Semiconductor Digest USA Overview The 2026 Electronic Components Technology Conference (ECTC) showcased significant advancements in hybrid bonding by Applied Materials, EV Group, imec, and Leti. Key breakthroughs include improved bonding... -
Indium Corporation Unveils Next-Gen Copper Sintering Paste for High-Power Semiconductors, Achieving Gold/Silver-Free High Reliability Die-Attach
Indium Corporation USA Overview Indium Corporation presented a next-generation copper sintering paste for high-power semiconductor applications at ICEPT 2026. This innovative paste provides high reliability, exceptional thermal and elect... -
Indium Corporation Unveils Plating-Free Copper Sintering Paste and Bi-Free Mid-Temp Solder at ICEPT 2026
Indium Corporation USA Overview Indium Corporation will present two significant advancements at ICEPT 2026: a next-generation copper sintering paste for high-power semiconductors and a lead-free, bismuth-free indium-containing mid-temper... -
Kynix Explains HBM4 Hybrid Copper Bonding Achieves Over 20% Thermal Performance Improvement, Enabling Stable Clock Speeds Under AI Loads
Kynix China Overview Kynix explains that Hybrid Copper Bonding (HCB) technology for HBM4 improves thermal performance by over 20%. This method eliminates solder bumps and underfill, directly connecting copper layers to significantly redu... -
Samsung Announces HBM4E Hybrid Copper Bonding Reduces Package Height by Over 15% While Improving Thermal Characteristics
Sammy Fans South Korea Overview Samsung has presented research on its HBM4E packaging strategy, emphasizing that Hybrid Copper Bonding (HCB), which eliminates underfill materials, offers superior thermal properties compared to convention... -
Ring PCB Details Advanced Thermal Management for High-Power PCBAs: Strict TIM Application, Customized Thick Copper Reflow, and High-Density Thermal Via Arrays
Ring PCB China Overview Ring PCB provides solutions for ensuring thermal stability in high-power Printed Circuit Board Assembly (PCBA) systems through rigorous application of Thermal Interface Materials (TIMs), customized reflow temperat... -
AI Theme Propels Nikkei 225, Driving Significant Gains for Advanced Packaging Material Companies like Resonac and Mitsui Kinzoku
IG Japan Overview The latest Nikkei 225 analysis highlights the significant impact of the AI theme on the market, showing substantial gains for chemical manufacturers like Resonac, a global leader in advanced packaging materials and epox...
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