Copper– tag –
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Comprehensive Review of SiC Power Module Packaging: Silver and Copper Sintering Key to Enhanced Thermal and Electrical Performance
IEEE Xplore Unknown Overview A comprehensive review paper analyzes the latest technologies in SiC power module packaging, focusing on layout, material systems, and integration. The review emphasizes how advanced die-attach techniques, in... -
Plasma Surface Engineering for Automotive Thermal Management Maximizes TIM Wettability to Minimize Thermal Resistance
KeyLink USA Overview Advanced plasma surface treatment has been introduced to significantly reduce contact thermal resistance in EV powertrain cooling systems. This technology elevates substrate surface energy to over 72 mN/m, achieving ... -
Sn-Coated Cu Solder Paste via Transient Liquid Phase Bonding Offers High-Reliability for Power Device Packaging
MDPI Switzerland Overview This MDPI paper reports on the potential of Sn-coated Cu solder paste for power device packaging using Transient Liquid Phase Bonding (TLPB). While Cu offers excellent electrical and thermal conductivity, its ox... -
Henkel Expert Reveals Material Innovations Critical for Power Electronics Reliability and Thermal Management
EE Times USA Overview Dr. Bruchak Conley from Henkel discussed the pivotal role of material evolution in power electronics, emphasizing that die attach encapsulants and thermal interface materials (TIMs) dictate module reliability under ... -
CTE-Gradient Interconnect Technology Drastically Reduces Thermal Cycling Damage in SiC Inverters
PatSnap Eureka USA Overview PatSnap Eureka reveals an innovative approach to mitigate thermal cycling damage in SiC power inverter modules by creating biomimetic interconnects with a Coefficient of Thermal Expansion (CTE) gradient. This ... -
TANAKA to Unveil Advanced High-Conductivity Die-Attach Materials for Next-Gen Power Semiconductors at SEMICON Southeast Asia 2026
田中貴金属グループ Japan Overview TANAKA Precious Metals will showcase high-thermal-conductivity and high-reliability silver sintering pastes and AgSn TLP sheets for next-generation SiC and GaN semiconductors at SEMICON Southeast Asia 20...
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