Delamination– tag –
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Krayden Supplies High Thermal Conductivity Hysol GR60 Series EMC for IPMs, Enhancing Reliability of Automotive and Industrial Modules with 2.2 W/mK
Krayden USA Overview Krayden offers advanced encapsulation solutions for Intelligent Power Modules (IPMs), featuring Hysol GR60 series epoxy mold compounds (EMC) with superior thermal conductivity. The GR60 HT variant achieves a thermal ... -
Review Paper on Adhesives for Solid-State Batteries Published, Accelerating Next-Gen Battery Development
Journal of Electrochemical Energy Conversion and Storage Global Overview A review paper has been published summarizing recent research progress on adhesive technologies crucial for high-performance solid-state batteries. This paper metic... -
Scanning Acoustic Microscopy (SAM) Enables High-Precision Non-Destructive Detection of Internal Defects in Semiconductor Packaging
Infinita Lab USA Overview Scanning Acoustic Microscopy (SAM) is highlighted as a critical non-destructive tool for high-precision evaluation of internal defects in semiconductors, electronic packaging, and material science. SAM excels at... -
ResearchGate Paper: Semi-Interpenetrating Organogel OPSA with Reversible Hydrogen Bonding Developed for Dynamic Optical Devices
ResearchGate (Wiley - Advanced Materials Technologies) Global Overview A ResearchGate paper reports the development of semi-interpenetrating network organogel optical pressure-sensitive adhesives (OPSAs) with reversibly controlled hydrog... -
Sumitomo Bakelite Develops G785 Series High-Tg Epoxy Molding Compounds with Industry-Leading 230°C Tg for Next-Gen SiC Power Modules
Sumitomo Bakelite Co., Ltd. Japan Overview Sumitomo Bakelite has developed the 'G785 Series' of high-Tg epoxy molding compounds for next-generation SiC power modules, achieving an industry-leading glass transition temperature (Tg) of 230... -
PatSnap Eureka Report: Thermal Stress Impact on Battery Adhesive Strength Over Time, Driven by New EU Regulations
PatSnap Eureka Global Overview A PatSnap Eureka report emphasizes understanding thermal stress effects on battery adhesives to prevent delamination and bond failure in EV and grid-scale energy storage systems. Research focuses on high-te... -
PatSnap Eureka Report: Optimizing Adhesive Coverage to Reduce Cell Delamination Risks in Advanced Packaging and Flexible Displays
PatSnap Eureka Global Overview A PatSnap Eureka report highlights the critical need for improved adhesive technologies and optimized coverage to prevent cell delamination in advanced semiconductor packaging and flexible display sectors. ... -
Kingfa Advances Low-Stress Crystallization Techniques for Mold Compounds, Mitigating Warpage in Advanced Packaging
Global Semiconductor Global Overview Advanced mold compounds face challenges like package warpage, delamination, and mechanical property degradation due to inherent stresses during crystallization. Kingfa adopts advanced nucleation syste... -
Adhesive Type Critically Influences Delamination Risk and Recyclability in High-Stress Applications
PatSnap Eureka Global Overview Adhesive bonding technologies are evolving to join diverse materials with high reliability, though delamination remains a challenge, particularly in high-stress applications. While structural adhesives like...
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