ECTC– tag –
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2026 ECTC Highlights: Applied Materials and Partners Pioneer Hybrid Bonding with Fine-Pitch Copper and Ultra-Low Temperature Annealing
Semiconductor Digest USA Overview The 2026 Electronic Components Technology Conference (ECTC) showcased significant advancements in hybrid bonding by Applied Materials, EV Group, imec, and Leti. Key breakthroughs include improved bonding... -
Amkor Technology Presents Large Package Performance Evaluation of Glass Core Substrates for AI and HPC Applications at ECTC 2026
Amkor Technology South Korea Overview Amkor Technology's JongMin Park presented a technical poster on "Large Package Performance Evaluation of Glass Core Substrates for AI and HPC Applications" at ECTC 2026, a leading forum in electronic... -
ECTC 2026 Reveals Breakthroughs in Advanced Packaging: CoWoS-R Warpage Management, IBM’s DBrM, and Nanocrystalline Diamond Cu/Sn Microbumps Highlight Thermal and Integration Advances
SemiAnalysis USA Overview ECTC 2026 showcased advancements in underfill and sealant materials for CoWoS-R warpage management. IBM's 'Direct Bridge Multi-die (DBrM)' using die-edge adhesive technology was introduced, alongside collaborati... -
Low Warpage Mold Compound Solutions Highlighted at IEEE ECTC 2026 Address 2.5D/3D Packaging Challenges
Advanced Packaging World (ECTC 2026 Post-Conference Review) Global Overview At the IEEE ECTC (Electronic Components and Technology Conference) 2026 post-conference review, multiple low warpage molding compound solutions addressing warpag... -
Semiconductor Engineering Report Highlights AI-Driven Optical-Logic Integration and Hybrid Bonding for Increased Interconnect Density
Semiconductor Engineering USA Overview A June 2026 Semiconductor Engineering report emphasizes that AI systems are driving a closer integration of optics and logic, necessitating co-evolution in fabrication, packaging, thermal management... -
ECTC 2026: Intel Foundry and Amkor Announce Advanced Packaging Technologies for AI/HPC and U.S. Manufacturing Capacity Expansion
Intel Newsroom, Amkor Technology Blog, Semiconductor Engineering USA Overview The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased advanced packaging technologies redefining scalability limits for AI and high-pe...
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