Film– tag –
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3M Launches Cooling Film Reflecting Over 85% Solar Radiation, Cutting Vehicle Interior Temperatures by up to 10°F Without Energy Input
Simply Wall St News USA Overview 3M has introduced its 3M Cooling Film, a roof-applied heat management product for vehicles that reflects over 85% of solar radiation, reducing interior temperatures by up to 10°F (approx. 5.6°C) without c... -
Penn State and Kurt J. Lesker Company Form Atomic-Scale Processing Hub for Semiconductors and Quantum Tech
Penn State USA Overview Penn State University and Kurt J. Lesker Company have established a strategic partnership to accelerate advanced atomic-scale processing methods crucial for semiconductors, advanced packaging, quantum, and photoni... -
Glass Core Substrates Poised to Resolve Warpage Issues in Data Center AI Accelerators by 2030, Addressing ABF Substrate Limitations
Tom's Hardware USA Overview The increasing demand for high-performance AI accelerators in data centers highlights critical supply shortages and material limitations, particularly warpage issues with large-scale ABF (Ajinomoto Build-up Fi... -
AZoM Explains Polyimides’ Indispensable Role in Semiconductor Packaging, Critical for HBM and Chiplet RDLs
AZoM UK Overview AZoM has detailed the indispensable, multifunctional role of polyimides in semiconductor packaging, simultaneously providing insulation, adhesion, pattern definition, and stress control at the thin-film interface between... -
Cambium Unveils ApexFrame 5000, a High-Temperature Laminating Film Adhesive for Aerospace and Defense, Withstanding Over 315°C
PR Newswire (via Cambium) USA Overview Advanced materials developer Cambium has launched ApexFrame™ 5000, a phthalonitrile-based film adhesive specifically designed for demanding high-temperature bonding applications. This new product me... -
Kuraray Showcases KURARAY POVAL™ PVOH and Mowital™ PVB Resins for Semiconductor and Electronics Markets at SEMICON Taiwan 2026
SpecialChem Taiwan Overview Kuraray is set to present its KURARAY POVAL™ polyvinyl alcohol (PVOH) and Mowital™ polyvinyl butyral (PVB) resin grades at SEMICON Taiwan 2026 (September 2–4), targeting the semiconductor and electronics manuf... -
H-O Products Offers High-Performance Polyimide and PEEK Films for Industrial Applications, Withstanding Temperatures from -269°C to Over +240°C
H-O Products USA Overview H-O Products is supplying high-performance films, papers, and laminates, including polyimide films and Victrex APTIV® PEEK films, engineered for extreme temperature resilience from -269°C to +240°C (and up to +4... -
Master Bond Offers High-Strength, High-Reliability Die Attach Epoxy Adhesives for Microelectronics
Master Bond USA Overview Master Bond provides die attach epoxy adhesives for microelectronic semiconductor packaging and chip-on-board assemblies, featuring high bond strength, thermal cycling resistance, mechanical shock/vibration resis... -
Saint-Gobain Offers High-Performance Adhesives and Bonding Tapes, Including PFAS-Free Alternatives, for EV Battery Applications
Saint-Gobain France Overview Saint-Gobain provides comprehensive high-performance adhesive and bonding tape solutions, gasket foams, spacer tapes, and specialty films for demanding industries like electronics, energy, aerospace, and espe... -
Henkel Unveils Loctite ABLESTIK CDF900 Series Conductive Die Attach Film with >8 W/m-K Thermal Conductivity for AI and HPC Packages
SpecialChem Germany Overview Henkel Adhesive Technologies has introduced the new Loctite ABLESTIK CDF900 series conductive die attach film (cDAF), revolutionizing advanced packaging for AI accelerators and HPC processors. This innovative...
