Fraunhofer– tag –
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SiC Power Modules Get a Boost: Advanced Packaging with AMB and Embedded Die Transforms EV and AI Data Centers
[Industry Publication/Research] Global Overview Advanced packaging technologies for Silicon Carbide (SiC) power modules are dramatically improving thermal management and power density in electric vehicle (EV) inverters and AI data center... -
Fraunhofer Unveils APECS Pilot Line: Accelerating Advanced Packaging and Heterogeneous Integration Under EU Chips Act
Fraunhofer-Institut für Angewandte Festkörperphysik IAF Germany Overview Under the EU Chips Act, Fraunhofer IAF has established APECS, a new pilot line for advanced packaging and heterogeneous integration, designed to bridge microelectro... -
Fraunhofer ISC Commercializes Renewable-Based, Fluorine-Free ORMOCER® Coatings, Achieving PFAS-Equivalent Performance and Over 25% Environmental Impact Reduction
Fraunhofer ISC Germany Overview Germany's Fraunhofer ISC has developed and commercialized fluorine-free ORMOCER® coatings from renewable and non-toxic compounds as a robust PFAS alternative. These inorganic-organic hybrid polymers delive... -
CIGS-Perovskite Tandem Solar Cell Shatters Efficiency Record at 25.5%, Certified by Fraunhofer ISE
Technology Park Berlin Adlershof Germany Overview Researchers from Humboldt University and Helmholtz-Zentrum Berlin (HZB) have set a new world record for CIGS-perovskite tandem solar cell efficiency, achieving 25.5%. Certified by Fraunho... -
Fraunhofer Institute Advances Debondable Adhesives for Electronics Recycling, Boosting Material Recovery
Fraunhofer Press Release Germany Overview Researchers at the Fraunhofer Institute have announced significant advancements in debondable adhesive technology, poised to dramatically improve electronics recycling efficiency. This technology... -
Fraunhofer Develops DUV-Assisted Athermal Laser Grooving for Low-κ Dielectrics in Advanced Packaging
Karriere Fraunhofer-Gesellschaft Germany Overview Fraunhofer ILT is exploring a novel dual-pulse approach, DUV-assisted athermal laser grooving, for low-κ dielectrics in advanced microelectronics packaging. This technology temporarily ge... -
U.S. Department of Energy Drives Research on Novel Encapsulants and Edge Sealing to Boost Thin-Film PV Module Durability
U.S. Department of Energy (DOE) USA Overview The U.S. Department of Energy (DOE) is advancing research into novel encapsulants and edge sealing methods to significantly enhance the durability and reliability of thin-film photovoltaic (PV... -
Oxford PV CEO States Perovskite Tandem Solar Cells are ‘Stealth Disruptor’ to Reach Gigawatt Production by 2028 at Intersolar Europe 2026
PV Tech Germany Overview At Intersolar Europe 2026, David Ward, CEO of Oxford PV, predicted that perovskite-silicon tandem technology would commence 'gigawatt-scale' production by 2028, becoming a 'stealth disruptor' that can fundamental... -
Oxford PV and Fraunhofer ISE Achieve 25.6% Module Efficiency with Shingled Perovskite-Silicon Tandem Solar Cells
PV Magazine Germany Overview Oxford PV, in collaboration with Fraunhofer ISE, has announced a breakthrough 25.6% module conversion efficiency for perovskite-silicon tandem solar cells utilizing an innovative shingled architecture. This '... -
Oxford PV and Fraunhofer ISE Achieve 25.6% Efficiency for Perovskite-Silicon Tandem Module with Shingled Design
pv magazine Global Germany Overview Oxford PV, in collaboration with Fraunhofer ISE, achieved 25.6% power conversion efficiency for a perovskite-silicon tandem module incorporating Fraunhofer ISE's Matrix Shingle architecture. This innov...
