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Taiwan’s NYCU and TSMC Achieve 0.42-Nanometer Semiconductor Interface Breakthrough, Revolutionizing Transistor Performance
ScienceDaily Taiwan Overview Researchers from National Yang Ming Chiao Tung University (NYCU), in collaboration with TSMC Corporate Research, have achieved a 0.42-nanometer breakthrough in atomically thin semiconductors by precisely engi... -
IMEC, TSMC, Intel, and Samsung Pursue Atomically-Thin 2D Transistors to Sustain Moore’s Law Beyond Silicon in 2026
Internet Pros USA Overview As silicon transistors approach scaling limits, industry leaders IMEC, TSMC, Intel, and Samsung are shifting to atomically-thin 2D semiconductors for next-generation chips. Materials like molybdenum disulfide (... -
Applied Materials Unveils New ALD and Selective Etch Systems to Advance 3D Chip Scaling
Stock Titan (Company Press Release) USA Overview Applied Materials announced new deposition (Centris Spectral SiN ALD) and selective etch systems to advance 3D chip scaling. The Centris Spectral SiN ALD system is designed for uniform, lo... -
Samsung Unveils Industry’s Smallest 3D Stacked FET at VLSI Symposium for AI/HPC, Boosting Performance and Power Efficiency
MK South Korea Overview Samsung Electronics presented groundbreaking research on the industry's smallest "3D stacked FET" technology at the 2026 VLSI Symposium, earning the Best Paper award among over 1,000 submissions. This innovative a... -
Carbon Nanotubes Emerge as Prime Post-Silicon Candidate, Promising Sub-10nm Performance Gains
Nanotechnology Perceptions Netherlands Overview Carbon Nanotubes (CNTs) are emerging as a leading candidate for post-silicon logic, propelled by three exceptional properties: quasi-ballistic transport with mean free paths over 1µm enabli...
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