Junction– tag –
-
CHT-Silicones Unveils Silso protect 21190 A/B: A 2-Component Low-Flammability Silicone Elastomer for Electronic Potting and Encapsulation
CHT-Silicones Germany Overview CHT-Silicones has launched Silso protect 21190 A/B, a two-component silicone elastomer system engineered for electronic potting and encapsulation applications. This product offers robust protection against ... -
Advanced Die Attach Solder Paste for High-Power Packaging: Achieving >60-70 W/m·K Thermal Conductivity and Precision Filling
Global SMT & Packaging Global Overview A Global SMT & Packaging article emphasizes the critical role of die attach solder paste in high-power packaging, achieving excellent thermal conductivity of 60-70 W/m·K (and >70 W/m·K with C... -
New 230°C High-Heat-Resistant Epoxy Encapsulation Material (EME-G785 Series) Boosts SiC Power Module Applications and Thermal Performance
creating nano technologies inc. Japan Overview Creating Nano Technologies Inc. has introduced the EME-G785 series, a new epoxy encapsulation material with 230°C heat resistance, poised to expand applications for SiC power modules. This m... -
Samsung Announces HBM4E Hybrid Copper Bonding Reduces Package Height by Over 15% While Improving Thermal Characteristics
Sammy Fans South Korea Overview Samsung has presented research on its HBM4E packaging strategy, emphasizing that Hybrid Copper Bonding (HCB), which eliminates underfill materials, offers superior thermal properties compared to convention...
1