Kinsus– tag –
-
High-End ABF Substrate Supply Faces Critical Shortage Amid Gigantic AI Chip Growth, Fueling Intense Competition Among Taiwanese Manufacturers
Tom's Hardware Taiwan Overview The escalating computational power and physical size of AI chips have led to a severe global shortage in the supply of high-end Ajinomoto Build-up Film (ABF) substrates, a core component. In response, inten... -
High-End ABF Substrate Shortage Intensifies Due to Massive AI Chips: Taiwanese Makers & Equipment Suppliers Face Fierce Competition
Medium (by Julien Nauy) International Overview The high-end ABF (Ajinomoto Build-up Film) substrate market for AI chips faces a severe supply shortage, reflecting a 're-evaluation of manufacturing difficulty' distinct from traditional AB... -
AI Chip HBM Integration to Drive 29% ABF Substrate Shortage by 2028; $19.1B Expansion Unlikely to Offer Short-Term Relief
Unknown Taiwan Overview The rapid integration of High Bandwidth Memory (HBM) into AI chips is set to drive a 39% Compound Annual Growth Rate (CAGR) in ABF substrate demand between 2025 and 2028. This surge is projected to create a supply... -
Wah Lee and Asahi Kasei Double Photoresist Capacity in Tainan to Capitalize on AI Advanced Packaging Boom and ABF Substrate Demand
BigGo Finance International Overview Wah Lee and Asahi Kasei are doubling high-resolution dry film photoresist capacity in Tainan to meet surging ABF substrate demand driven by AI, HPC, and advanced packaging. With the ABF substrate shor... -
Ibiden and Unimicron Unveil Over $5 Billion Investment to Dramatically Expand AI Server ABF Substrate Production
Next Financial Japan Overview Japanese Ibiden and Taiwanese Unimicron are jointly investing over ¥800 billion (approximately $5 billion USD) to significantly increase production capacity for high-performance ABF (Ajinomoto Build-up Film)...
1