NVIDIA– tag –
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Market Trends
AI Data Center Boom Fuels Power & Cooling Infrastructure Investment, Liquid Cooling Market to Hit $23.23 Billion by 2035
DataM Intelligence India Overview The surging demand for AI is reshaping the industrial equipment supply chain, driving significant investment in data center power and cooling infrastructure. Manufacturers of generators, electrical syste... -
New Technology
AI Chip Race Shifts to Advanced Packaging as 130M Accelerators Ship; TSMC’s CoWoS Dominates, Intel Pursues Alternatives
The Korea Economic Daily South Korea Overview The competitive landscape in the AI semiconductor market is shifting from process nodes to advanced packaging, with over 130 million AI accelerators projected to ship with advanced-packaged o... -
Market Trends
AI Workloads Fundamentally Reshaping Data Center Power Demand and Infrastructure, IEA Projects Doubled Consumption by 2030
Data Center Dynamics UK Overview AI workloads are profoundly altering data center power demand and infrastructure planning, driven by concentrated compute, heat, and electrical loads per rack. High-power GPUs in AI training clusters nece... -
Space Industry
Orbital Data Centers: A “Crazy Idea” Supported by The Republic News, as Starcloud Launches NVIDIA GPUs, Axiom Builds Nodes
The Republic News USA Overview The Republic News published an editorial endorsing orbital data centers as a "crazy idea" to address terrestrial data center issues like cost, resources, and political opposition. Starcloud Inc. is orbiting... -
Semiconductor Back-End
HBM Supply Crisis of 2026 Projected to Persist Until 2027, Redefining AI Hardware Deployment Bottleneck
EnkiAI USA Overview Explosive growth in the AI sector has triggered a structural HBM supply crisis, making it the primary bottleneck for AI hardware deployment throughout 2026, projected to last until at least 2027. The market has shifte... -
Semiconductor Back-End
Samsung HBM4 Yield Dramatically Improves from Under 60% to 80%; SK Hynix Labor Talks Stall, Intensifying AI Memory Race
TrendForce Taiwan Overview Samsung's HBM4 yield has dramatically improved from under 60% at launch to 80% within months, according to Seoul Economic Daily. This swift process enhancement by Samsung comes amid tight HBM supply, surpassing... -
Semiconductor Back-End
SK Hynix Poised to Dominate HBM4 Market with 70% Price Hike and $7B Global Investment for AI Acceleration
SK Hynix South Korea Overview SK Hynix, commanding over 60% of the high-bandwidth memory (HBM) market, projects a nearly 70% price increase for its next-generation HBM4, slated for 2026. To meet soaring AI demand, the company is committi... -
Semiconductor Back-End
Samsung’s Aggressive HBM4 Investment Targets Top HBM Market Share Next Year, Attracting NVIDIA and AMD Interest
Sammy Fans South Korea Overview According to UBS forecasts, Samsung Electronics is poised to become the world's leading HBM memory manufacturer next year, driven by aggressive investments and expanded production in HBM4. The rapid surge ... -
Semiconductor Back-End
Micron Initiates Mass Production of 36GB 12-Layer HBM4 for NVIDIA Vera Rubin, Boosts US Semiconductor Investment Over $250 Billion
openPR.com USA Overview Micron Technology commenced mass production of its advanced 36GB 12-layer HBM4 memory in March 2026, shipping to NVIDIA for its Vera Rubin platform. This move underscores the market's rapid shift towards higher-ca... -
Semiconductor Back-End
TSMC CoWoS & SoIC Packaging Become Primary AI Chip Bottleneck, Forecasting 10-20% Global Supply Shortfall by 2027 Amidst Doubling Demand
Exponential Industry Taiwan Overview TSMC's CoWoS and SoIC packaging technologies are identified as the primary physical constraints in AI GPU and accelerator production. Global CoWoS demand is projected to double from 1.3-1.4 million wa...