NVIDIA– tag –
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Semiconductor Back-End
TrendForce Reports TSMC Expanding CoWoS Front-End Outsourcing to OSATs Amid Surging NVIDIA ASIC Demand
TrendForce Taiwan Overview TrendForce reports that TSMC is reportedly expanding the outsourcing of key front-end processes for its CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging to OSATs (Outsourced Semiconductor Assembly and Test... -
Photonics
Photonics: The Optical Backbone of AI’s Future — A Market Surge Amidst Geopolitical Scrutiny
Facebook USA Overview The exponential growth of AI data centers is pushing copper interconnects to their limits, creating critical power, thermal, and bandwidth challenges. Photonics technology is emerging as the pivotal solution, drivin... -
Photonics
Silicon Photonics Heats Up: GlobalFoundries Drives Innovation While Taiwan Foundries Secure Strategic Edge
Daily Gazette Global Overview GlobalFoundries is rapidly advancing next-generation silicon photonics, with industry leaders like NVIDIA leveraging its 300mm platform. Concurrently, TSMC is integrating silicon photonics and HBM via 3D pac... -
Photonics
Marvell Technology Enters S&P 500, Stock Triples in 2026 as Data Center Business Drives 76% of Revenue, Led by AI Optical Modules and 51.2T Ethernet Switches
Investing.com AU Australia Overview Marvell Technology has been added to the S&P 500 index, with its stock nearly tripling in 2026, demonstrating rapid growth fueled by AI infrastructure investments. The company reported that 76% of ... -
Photonics
NVIDIA Commits Over $15 Billion in Strategic Investments to Lumentum, Marvell, Coherent, and Corning to Secure and Expand Photonics Supply Chain for AI Infrastructure
HRM Outlook USA Overview In 2026, NVIDIA strategically invested over $15 billion across seven companies, including Lumentum, Marvell Technology, Coherent, and Corning, to secure and expand the critical photonics and optical interconnect ... -
Photonics
Major Foundries Advance CPO Roadmaps as NVIDIA Spectrum-X and Broadcom Taurus BCM83640 Enter Mass Production and 400G/Lane DSP Era
Tom's Hardware USA Overview Leading foundries (TSMC, Intel, Samsung, GlobalFoundries) are aggressively pursuing Co-Packaged Optics (CPO) roadmaps to address scale-up connectivity bottlenecks in AI clusters. NVIDIA has initiated mass prod... -
Photonics
China’s Zhongji Innolight Secures $6.81 Billion in Record Hong Kong IPO Amid Deepening Indium Phosphide Shortage for AI Optics
TrendForce Taiwan Overview Zhongji Innolight, a leading Chinese optical transceiver manufacturer, raised HK$53.41 billion ($6.81 billion) in Hong Kong's largest IPO of 2026, aiming to expand its high-speed optical module business for maj... -
Photonics
Tokyo Electron: Co-Packaged Optics (CPO) Key to Unlocking AI Data Center Performance, Slashing Power and Bottlenecks; NVIDIA and Broadcom Integrate Technology
Tokyo Electron Japan Overview Tokyo Electron highlights Co-Packaged Optics (CPO) as a pivotal technology for next-generation AI data centers, significantly reducing power consumption and mitigating communication bottlenecks. CPO achieves... -
New Technology
Nvidia and Groq AI Accelerators Boost AI Application Performance by up to 1000x, Expediting Next-Gen AI Model Development
Grooper USA Overview AI accelerators are high-performance hardware or software systems designed to dramatically speed up AI application processing. Leading chipmakers like Nvidia and Groq are manufacturing specialized hardware capable of... -
Quantum Computing
Quantinuum and NVIDIA Validate Generative Quantum AI Framework ‘GenQAI’ for Pharmaceutical R&D, Optimizing Computational Chemistry
Quantinuum USA Overview Quantinuum, NVIDIA, and a major pharmaceutical company have successfully demonstrated 'GenQAI,' a proof-of-concept framework integrating high-performance computing (HPC), generative AI (GenAI), and quantum computi...