NVIDIA– tag –
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TSMC Moves to Large-Format Glass Substrates with CoPoS to Address CoWoS Capacity for AI Chips, Targeting 2028-2029 Mass Production
36Kr, Semiconductor Industry Watch, AI Weekly Taiwan Overview TSMC has launched a pilot line for its CoPoS (Chip-on-Panel-on-Substrate) advanced packaging at Taiwan's VisEra, aiming to alleviate the critical CoWoS capacity bottleneck for... -
NVIDIA and Broadcom Commence Mass Production of Co-Packaged Optics (CPO) Switches: Poised to Cut Data Center Power Consumption by Up to 3.5x
Electronics360 USA Overview NVIDIA and Broadcom have initiated mass production of Co-Packaged Optics (CPO) switches, designed to significantly reduce data center power consumption and latency. NVIDIA's Spectrum-X CPO switch, co-developed... -
Lightmatter Joins NVIDIA NVLink Fusion Ecosystem, Accelerates Photonic Interconnect Strategy for AI Data Centers with $850M Funding at $4.4B Valuation
International Banker USA Overview AI hardware and silicon photonics startup Lightmatter has joined NVIDIA's NVLink Fusion ecosystem, accelerating the deployment of high-performance optical interconnects for AI infrastructure. The company... -
AI Data Centers Rapidly Transition to Photonic Interconnects Beyond Copper Limits, Driven by 800G/1.6T Devices and OCI MSA Standardization
Tom's Hardware USA Overview AI data centers are rapidly migrating to photonic interconnects due to copper's physical limitations, with accelerating shipments of 800G pluggable devices and the introduction of 1.6T modules. The Optical Com... -
AI Data Centers Accelerate Shift to 800G/1.6T Optical Interconnects; OCI MSA Defines Common Optical Physical Layer
MLQ News USA Overview AI data centers are rapidly transitioning from copper to optical interconnects due to copper's speed limitations, with accelerated adoption of 800G pluggable transceivers and the introduction of 1.6T products. The O... -
NVIDIA Integrates Next-Gen Silicon Photonics Optical Interconnects to Boost GPU Communication for Large-Scale AI Models
HPC Wire United States Overview NVIDIA has announced the adoption of a new generation of optical interconnect technology for its upcoming GPU clusters, significantly enhancing chip-to-chip and board-to-board optical connectivity. This te... -
Forbes Reports LAM Research and Applied Materials Enhance Semiconductor Manufacturing Productivity by up to 35x with AI Integration; Synopsys, Siemens, and NVIDIA Strengthen Collaboration
Forbes USA Overview Forbes highlights how leading semiconductor firms like LAM Research and Applied Materials integrate AI to boost design and manufacturing productivity. LAM's "Semiverse" and Applied Materials' "Ai^x" leverage AI and di... -
NVIDIA and Applied Materials Propel Semiconductor Innovation with GPU-Accelerated AI, Achieving Up to 55x Speedup
NVIDIA Technical Blog USA Overview NVIDIA and Applied Materials have announced a strategic partnership to revolutionize semiconductor innovation through the integration of AI and GPU-accelerated simulations. This collaboration leverages ... -
IBM and RIKEN Achieve Quantum Supercomputing Record in Iron-Sulfur Molecule Simulation; NSF Invests $100M in Quantum-Nanotech Infrastructure
Quantum Computing Report USA Overview RIKEN and IBM have established a new record in simulating the electronic structure of iron-sulfur molecules using quantum-centric supercomputing, pushing the boundaries of computational science. Conc... -
AI Industry Unpacked: July 25, 2026 – NVIDIA’s Blackwell Ultra, Microsoft’s Agentic AI, and EU Regulatory Milestones
AI Industry Daily International Overview On July 25, 2026, the AI industry witnessed pivotal developments, including NVIDIA's detailed release on its next-generation 'Blackwell Ultra' AI chip, Microsoft's advancements in Agentic AI, and ...
