Samsung Electro-Mechanics– tag –
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Samsung Electro-Mechanics and Qualcomm Jointly Develop Organic Bridge for Advanced 2.1D AI Semiconductor Packaging
The Elec South Korea Overview Samsung Electro-Mechanics and Qualcomm have collaborated to develop an 'organic bridge' technology for advanced 2.1D packaging in AI semiconductors. This innovation facilitates high-density, high-bandwidth i... -
Samsung Electro-Mechanics Unveils Next-Gen Package Substrate Technologies for AI & Servers at KPCA Show 2026, Highlighting Warp Reduction & High-Density Interconnects
Samsung Electro-Mechanics South Korea Overview Samsung Electro-Mechanics showcased a comprehensive suite of next-generation semiconductor package substrate technologies targeting the AI and server markets at 'KPCA Show 2026.' The company... -
AI Accelerator ABF Substrate Shortage to Exceed 40% by 2028; Ibiden, Unimicron, Samsung Electro-Mechanics Rush Billions in Capacity Expansion
Tom's Hardware Japan Overview The supply shortage of ABF (Ajinomoto Build-up Film) substrates for AI accelerators is projected to worsen significantly, potentially reaching approximately 10% by late 2026, 21% by 2027, and over 40% by 202... -
Samsung Electro-Mechanics Unveils Five Next-Gen Semiconductor Package Substrate Products for AI, Automotive, and Mobile Markets at KPCA Show
Global Sources South Korea Overview Samsung Electro-Mechanics showcased next-generation semiconductor package substrate technologies at KPCA Show, targeting high-end chip applications like AI servers, automotive systems, and mobile devic... -
TRUMPF Resolves Glass Substrate TGV Coating Bottleneck with High-Power HiPIMS, Accelerating Next-Gen AI Chip Packaging
TRUMPF Germany Overview TRUMPF has introduced a High-Power Impulse Magnetron Sputtering (HiPIMS) approach to address a key manufacturing challenge in next-generation AI chip packaging: reliably coating millions of minute Through-Glass Vi... -
Korean Tech Giants Accelerate AI Substrate Production Amid Soaring Demand, Nearing 90% Utilization
TrendForce Taiwan Overview The proliferation of AI data centers has created a critical shortage and driven up prices for advanced substrates essential for GPUs and HBM. In response, Samsung Electro-Mechanics (SEM) and LG Innotek are aggr... -
Glass Substrates Emerge as Key Breakthrough for Next-Gen AI Chip Packaging: Intel, TSMC, Samsung Accelerate Development
Industry Analyst International Overview Glass substrates are increasingly recognized as a critical breakthrough for next-generation AI chip packaging, with industry leaders like Intel, TSMC, and Samsung Electro-Mechanics accelerating the... -
Samsung Electro-Mechanics Boosts FC-BGA Substrate Capacity by 20% for AI/HPC, Enhances Competitiveness with Fine-Pitch Wiring
The Korea Economic Daily South Korea Overview Samsung Electro-Mechanics (SEMCO) announced a 20% expansion of its high-end FC-BGA substrate production capacity in South Korea, driven by surging demand from AI/HPC applications. This strate... -
Morgan Stanley Taps Samsung Electro-Mechanics as Top Korean Tech Pick Amid Surging AI Chip Substrate Demand
Evrim Ağacı Turkey Overview Morgan Stanley has elevated Samsung Electro-Mechanics to its premier Korean tech stock, citing the escalating technical demands of AI chip designs on advanced substrates. As AI processors become larger, multi-... -
Japan’s Shinko Electric Develops 22-Layer Glass Substrates for AI Chips, Resolving Internal Cracking and Delamination Issues
TrendForce Japan Overview As AI chips demand larger packages, intensifying competition in glass substrates, Japan's Shinko Electric Industries has successfully developed 22-layer glass substrates with 11 copper wiring layers on each side...
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