Samsung Electro-Mechanics– tag –
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ABF Substrate Shortages Projected Through 2028 Amid AI Boom; Taiwanese, Japanese, Korean Manufacturers Secure Orders Until 2030
digitimes Taiwan Overview The global AI computing infrastructure boom is rapidly escalating demand for GPUs, CPUs, and ASICs, leading to projected ABF (Ajinomoto Build-up Film) substrate shortages starting in 2026 and worsening through 2... -
Samsung Electro-Mechanics Doubles Down on AI: Vietnam Plant to Lead Advanced Packaging Substrate Surge
Vietnam Korea Times Vietnam Overview Samsung Electro-Mechanics (SEMCO) is poised to significantly expand its production of advanced packaging substrates for AI semiconductors, with a reported 2.4-fold capacity increase at its Thai Nguyen... -
Samsung Electro-Mechanics Sees Semiconductor Package Substrate Utilization Rate Soar to 89%, Driven by AI Data Center Demand
연합뉴스 (Yonhap News) South Korea Overview Samsung Electro-Mechanics reported a significant increase in its semiconductor package substrate utilization rate, reaching an average of 89% in the first half of the year—a 19 percentage point... -
Samsung Electro-Mechanics Fast-Tracks Glass Substrates for AI Chip Packaging, Challenging Japanese Rivals for 2028 Mass Production
BusinessKorea South Korea Overview Samsung Electro-Mechanics (SEM) is accelerating its pursuit of glass substrates for AI chip packaging, targeting mass production by 2028 through its 'GlaSSEM' joint venture with Dongwoo Fine-Chem. This ... -
Advanced Package Substrate Market Heats Up: Ibiden Leads with $3.2 Billion Investment, Samsung Electro-Mechanics Challenges with Glass Substrates, Technical Hurdles Emerge
MK Japan Overview The package substrate market, crucial for AI semiconductor performance, is intensifying with major investments and technological competition. Japan's Ibiden maintains dominant leadership with ~35% market share, investin... -
Samsung Electro-Mechanics Challenges Ibiden in AI Server Package Substrates with FC-BGA and Glass Substrate Push
MK South Korea Overview Samsung Electro-Mechanics is aggressively challenging Ibiden's dominant market share in AI package substrates by enhancing its Flip-Chip Ball Grid Array (FC-BGA) and next-generation glass substrate technologies fo... -
Intel to Build $3.3 Billion Glass Core Substrate Manufacturing Facility in India to Bolster Advanced Packaging Supply
TrendForce USA Overview Intel, in collaboration with 3D Glass Solutions (3DGS), is progressing with plans to invest approximately $3.3 billion in an advanced packaging glass core substrate manufacturing facility in Odisha, India. The pla... -
Samsung Electro-Mechanics and Sumitomo Chemical Group Partner to Establish Glass Core Substrate Joint Venture
企業発表 South Korea Overview Samsung Electro-Mechanics and Sumitomo Chemical Group have signed an MOU to establish a joint venture for manufacturing "glass core" substrates, a critical material for next-generation advanced packaging. Ai...
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