SEMI– tag –
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AI’s Performance Breakthrough: Advanced Packaging, Power, and Interconnects Take Center Stage at SEMI Europe 2026
SEMI Europe Europe Overview SEMI Europe's 2026 Advanced Packaging Conference (APC) will spotlight 'Power and Interconnects Innovations Enabling AI System Performance,' emphasizing advanced packaging (AP) and test as crucial for scaling n... -
L&L Products Unveils Innovative Adhesives Including Heat-Activated Structural Tapes Curing in Automotive E-Coat Ovens for Enhanced Durability and Lightweighting
L&L Products USA Overview L&L Products has introduced a range of innovative adhesive solutions, notably L&L Bond Structural Adhesive Tapes, which are heat-activated and cure simultaneously in the E-coat oven for automotive struct... -
SEMICON West Relocates to Phoenix, Arizona, Bolstering U.S. Semiconductor Hub with TSMC’s $100 Billion Advanced Fab Plans
Arizona Commerce Authority USA Overview SEMI announced the permanent relocation of SEMICON West to Phoenix, Arizona, adopting an annual spring schedule from March 30 – April 1, 2027. This move reflects Arizona's rapid expansion as a semi... -
SEMI Advanced Packaging Summit 2026 Highlights HBM and 2.xD Packaging as Key Innovators for AI/HPC Performance and Power Efficiency
SEMI USA Overview The SEMI Advanced Packaging Summit 2026, themed "Packaging the Future of AI – From Silicon to Photon," deeply explored the evolution and industrial implications of packaging technologies for the AI era. Discussions high... -
Amkor Technology to Unveil Advanced Power Module Packaging Technologies for the AI Era at SEMI Advanced Packaging Summit 2026
Amkor Technology South Korea Overview Amkor Technology will participate in the SEMI Advanced Packaging Summit 2026 on July 15, with Shinji Baba, Senior Vice President, presenting on "Advanced Power Module Packaging Technologies." The pre... -
Unpacking the EV Battery Pack Thermal Gap Filler Market: Growth, Key Players, and Technological Imperatives
Inkrich Blog Japan Overview The inkrich blog reveals a rapidly expanding market for thermal gap fillers in electric vehicle (EV) battery packs, driven by the escalating demand for enhanced EV performance and efficiency. Critical for batt... -
Ajinomoto Fine-Techno Presents Advancements in ABF Film for AI Semiconductor Packaging, Supporting High-Performance Evolution
SEMI Global News Japan Overview Ajinomoto Fine-Techno has announced its latest advancements in ABF (Ajinomoto Build-up Film) technology for AI semiconductor packaging, contributing to higher performance and reliability in AI processors. ... -
Resonac’s 2016 Liquid Encapsulant Patent for 2.5D AI Semiconductors Skyrockets in Strategic Value Amid Generative AI Boom
YouTube (3-Min Semi with Tai) Japan Overview Resonac's patent for liquid encapsulants, filed in 2016 for AI semiconductor applications, has dramatically increased in strategic importance with the current generative AI boom. This technolo... -
Hanmi Semiconductor Secures ₩44.2 Billion SK hynix Order for HBM4 TC Bonders, Signaling Robust Advanced Packaging Equipment Market Growth
HTX South Korea Overview Hanmi Semiconductor has received a significant ₩44.2 billion (approx. $32 million) order from SK hynix for its TC Bonder 4.5 Griffin, crucial for next-generation HBM4 production, with delivery slated for early Se... -
ResearchGate Paper: Semi-Interpenetrating Organogel OPSA with Reversible Hydrogen Bonding Developed for Dynamic Optical Devices
ResearchGate (Wiley - Advanced Materials Technologies) Global Overview A ResearchGate paper reports the development of semi-interpenetrating network organogel optical pressure-sensitive adhesives (OPSAs) with reversibly controlled hydrog...
