SEMI– tag –
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FCS Group Secures Exclusive Taiwan/Southeast Asia Distribution Rights for CKST Glass Substrate Equipment, Entering AI Advanced Packaging Market
BigGo Finance Taiwan Overview FCS Group, an injection molding machine manufacturer, has secured exclusive distribution rights for CKST (China Korea Smart Technology) glass substrate advanced packaging equipment in Taiwan and Southeast As... -
EU’s BATRAW Project Develops Semi-Automated EV Battery Recycling Technology, Reducing Disassembly Time by 50-60%
CORDIS EU Overview The EU-funded BATRAW project has developed innovative new technologies for efficiently disassembling, recycling, and recovering critical raw materials from end-of-life electric vehicle (EV) batteries. The project intro... -
Simmtech to Invest 400 Billion Won in Next-Gen AI Server Substrate Production: Capacity Expansion Starts 2028
The Elec Inc. South Korea Overview Simmtech announced a phased 400 billion won (approx. $300 million) investment to expand production capacity for next-generation substrates used in AI servers. New facilities in Cheongju will boost outpu... -
KLA Unveils AI-Powered High-Speed, High-Precision Defect Inspection Solution to Boost Yield in Advanced Packages like CoWoS
SEMI Global USA Overview KLA has introduced a new AI-powered inspection system for high-speed, high-precision defect detection in high-density RDLs and 3D stacked structures. This solution supports yield management in advanced packaging ... -
ASMPT to Showcase Advanced Thermocompression and Hybrid Bonding Innovations for HPC and AI at SEMICON Taiwan 2026
ASMPT SEMI Solutions Taiwan Overview Global technology leader ASMPT announced it will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, supporting HPC, AI accelerators, silicon photonics, and Co-Packaged Optics (CPO) appl... -
Sumitomo Bakelite Unveils Novel Low-Stress Epoxy Compound for Next-Gen 2.5D/3D Packaging
SEMI Europe Conference News Japan Overview Sumitomo Bakelite has announced a groundbreaking epoxy molding compound (EMC) at SEMI Europe, specifically engineered for the intricate demands of 2.5D and 3D advanced packaging solutions. This ... -
Sumitomo Bakelite and Mitsubishi Chemical Raise Packaging Material Prices for CoWoS and HBM Amid Surging Demand
Global Times China Overview Increasing demand for advanced processes and packaging, coupled with rising energy and raw material costs from Middle East conflicts and China's tightened export controls on strategic minerals, is disrupting h... -
Fraunhofer IKTS Achieves Real-Time Detection of 8µm Packaging Seal Defects Using Optical Coherence Tomography (OCT)
Fraunhofer-Gesellschaft Germany Overview Researchers at Fraunhofer IKTS have developed an innovative inspection system based on Optical Coherence Tomography (OCT), successfully enabling continuous, real-time, and non-destructive detectio... -
Semiconductor Inspection Equipment Market to Reach $13.4 Billion by 2034, KLA Leads in Advanced Packaging Process Control
Exponential Industry USA Overview The semiconductor inspection equipment market is projected to grow at a 7.9% CAGR from 2026 to 2034, reaching $13.4 billion, driven by increasing AI chip complexity and advanced packaging adoption. KLA i... -
APC 2026: Advanced Packaging, Interconnects, and Chiplets Propel AI Systems Beyond Traditional Scaling
SEMI Europe Europe Overview The Advanced Packaging Conference (APC) 2026 convened to address the critical role of power delivery and interconnect innovations in driving AI system performance. As traditional device scaling approaches its ...
