SEMICON– tag –
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SEMICON West Relocates to Phoenix, Arizona, Bolstering U.S. Semiconductor Hub with TSMC’s $100 Billion Advanced Fab Plans
Arizona Commerce Authority USA Overview SEMI announced the permanent relocation of SEMICON West to Phoenix, Arizona, adopting an annual spring schedule from March 30 – April 1, 2027. This move reflects Arizona's rapid expansion as a semi... -
PM Modi Inaugurates Kaynes Semicon’s ₹33 Billion OSAT Facility in Gujarat, Targeting 2.3 Billion Chips Annually and 5,000 Jobs
YouTube (ANI News) India Overview Indian Prime Minister Narendra Modi announced the inauguration of Kaynes Semicon's OSAT (Outsourced Semiconductor Assembly and Test) facility in Sanand, Gujarat, which commenced commercial production on ... -
India’s Semiconductor Ecosystem Rapidly Expanding: Government Commits ₹1.275 Trillion for Semicon 2.0, First ATMP/OSAT Facility Operational
Asia Briefing India Overview India's semiconductor manufacturing ecosystem is rapidly expanding in 2026, with 13 approved semiconductor projects currently operational or under development, including the launch of the first ATMP/OSAT faci... -
South Korea’s JNTC and Japan’s TOPPAN Announce Partnership for AI Chip Glass Substrate Technology, Overcoming Organic Substrate Limits for Next-Gen Packaging
Tai (via Semiconductor News) South Korea Overview South Korea's JNTC and Japan's TOPPAN have forged a strategic partnership for next-generation glass substrate technology aimed at AI chips. As advanced packages integrating AI accelerator... -
Indian State of Madhya Pradesh Signs MoU for ₹6,200 Crore OSAT Facility with Paras Semiconductors, Advancing Heterogeneous Integration and 3D Packaging
ET Government India Overview The government of Madhya Pradesh, India, announced a Memorandum of Understanding with Paras Semiconductors to establish an advanced semiconductor packaging OSAT (Outsourced Semiconductor Assembly and Test) fa... -
Kaynes Technology Partners with Japan’s AOI Electronics to Build ₹3,307 Cr OSAT Plant in India, Boosting Semiconductor Back-End Capabilities
Sahi India Overview Kaynes Technology's subsidiary has formally partnered with Japanese OSAT leader AOI Electronics for a ₹3,307 crore (approx. $395 million USD) Sanand OSAT facility, slated for commercial operation in H2 2026. This coll... -
Rapidus Explores Panel-Level Packaging on Glass Substrates for Next-Gen AI/HPC Processors
Tom's Hardware Japan Overview Japanese semiconductor firm Rapidus is actively exploring the adoption of panel-level packaging (PLP) on large 600mm x 600mm glass panels for manufacturing high-end multi-chiplet processors designed for AI a... -
TANAKA to Unveil Advanced High-Conductivity Die-Attach Materials for Next-Gen Power Semiconductors at SEMICON Southeast Asia 2026
田中貴金属グループ Japan Overview TANAKA Precious Metals will showcase high-thermal-conductivity and high-reliability silver sintering pastes and AgSn TLP sheets for next-generation SiC and GaN semiconductors at SEMICON Southeast Asia 20...
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